A High Gain Multi-Port Series Fed Array Realized with Micromachined Low-Cost 3D-Printed Substrate

IF 2.5 4区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IETE Technical Review Pub Date : 2023-08-07 DOI:10.1080/02564602.2023.2242828

Swapna S, K. G S, Shiban K. Koul, A. Basu

引用次数: 0

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用微机械低成本3D打印基板实现高增益多端口串联馈电阵列

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IETE Technical Review 工程技术-电信学

CiteScore

5.70

自引率

4.20%

发文量

审稿时长

9 months

期刊介绍： IETE Technical Review is a world leading journal which publishes state-of-the-art review papers and in-depth tutorial papers on current and futuristic technologies in the area of electronics and telecommunications engineering. We also publish original research papers which demonstrate significant advances.