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What lies beneath the structure of intelligence? Overview of the special issue on the processes underlying intelligence

IF 4.3 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
ACS Applied Electronic Materials Pub Date : 2023-03-01 DOI:10.1016/j.intell.2023.101720
Marco Koch , Nicolas Becker , Samuel Greiff
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智力结构的下面隐藏着什么?概述了关于底层智能过程的特刊
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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来源期刊
ACS Applied Electronic Materials
ACS Applied Electronic Materials Multiple-
CiteScore
7.20
自引率
4.30%
发文量
567
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