Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

IF 2.2 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Electronic Packaging Pub Date : 2023-05-15 DOI:10.1115/1.4062531

Ping Sun, B. Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng

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Abstract

To solve the thermal management problem in the three-dimensional integrated circuit (3D-IC) with high integration and multi-layer, this paper establishes a 3D-IC interlayer microchannel model with various embedded TSV micro-pin fins to explore the temperature distribution of chips and flow velocity distribution inside the microchannel. The sense amplifier and half adder are selected as the heat source of the memory and processor in the calculation model, and the power densities of the circuit modules are 885 kW/m2 and 1.832 MW/m2 combined with the layout size, respectively. Meanwhile, the effects of the shape and arrangement of TSV micro-pin fins on the flow and heat transfer characteristics are investigated. The result shows that the 1.2:1 diamond micro-pin fin microchannel with staggered arrangement has the best overall flow and heat transfer performance. Compared with the basic circular micro-pin fin with the in-line arrangement, the average Nusselt number of this microchannel is improved by 3.20-3.37 times, and the maximum temperature of chips is controlled at 325.92-312.43 K for Re=628-1819.

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3D-Ic中TSV引脚鳍微通道电-热-流耦合多物理场分析

为了解决高集成度多层三维集成电路（3D-IC）中的热管理问题，本文建立了具有各种嵌入式TSV微引脚鳍的3D-IC层间微通道模型，以探索芯片的温度分布和微通道内的流速分布。在计算模型中，选择读出放大器和半加器作为存储器和处理器的热源，结合布局尺寸，电路模块的功率密度分别为885kW/m2和1.832MW/m2。同时，研究了TSV微针翅片的形状和布置对其流动和传热特性的影响。结果表明，交错排列的1.2:1金刚石微针鳍微通道具有最佳的整体流动和传热性能。与直列排列的基本圆形微针鳍相比，该微通道的平均努塞尔数提高了3.20-3.37倍，当Re=628-1819时，芯片的最高温度控制在325.92-312.43K。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Electronic Packaging 工程技术-工程：电子与电气

CiteScore

4.90

自引率

6.20%

发文量

审稿时长

3 months

期刊介绍： The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.