J. Bultitude, J. McConnell, L. Jones, G. Miller, J. Magee, A. Templeton, A. Gurav, R. Phillips
{"title":"A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors","authors":"J. Bultitude, J. McConnell, L. Jones, G. Miller, J. Magee, A. Templeton, A. Gurav, R. Phillips","doi":"10.4071/IMAPS.522150","DOIUrl":null,"url":null,"abstract":"There is a long-established market for high temperature multilayer ceramic capacitors (MLCCs) that operate at 150°C and higher in downhole oil and gas exploration, and military and aerospace applications. To maximize the capacitance density and achieve a high degree of mechanical robustness, stacks and leaded form factors have been used with high melting point–Pb-containing solders as the preferred interconnects. However, Pb-containing solders are limited to temperatures below 300°C and are banned from many commercial and automotive applications with further legislation limiting their use planned in the future. Common Pb-free solders such as SAC 305 or SnSb alloys are in widespread use, but their performance at prolonged exposures at 200°C is limited. Exposures to high reflow temperatures during assembly, especially successive reflow operations, can also compromise interconnect integrity. Higher temperature gold-containing solders are widely available, but these are cost-prohibitive and so are not viable ...","PeriodicalId":35312,"journal":{"name":"Journal of Microelectronics and Electronic Packaging","volume":"2017 1","pages":"000075-000082"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectronics and Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/IMAPS.522150","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 1
Abstract
There is a long-established market for high temperature multilayer ceramic capacitors (MLCCs) that operate at 150°C and higher in downhole oil and gas exploration, and military and aerospace applications. To maximize the capacitance density and achieve a high degree of mechanical robustness, stacks and leaded form factors have been used with high melting point–Pb-containing solders as the preferred interconnects. However, Pb-containing solders are limited to temperatures below 300°C and are banned from many commercial and automotive applications with further legislation limiting their use planned in the future. Common Pb-free solders such as SAC 305 or SnSb alloys are in widespread use, but their performance at prolonged exposures at 200°C is limited. Exposures to high reflow temperatures during assembly, especially successive reflow operations, can also compromise interconnect integrity. Higher temperature gold-containing solders are widely available, but these are cost-prohibitive and so are not viable ...
期刊介绍:
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.