An EMC Susceptibility Study of Integrated Basic Bandgap Voltage Reference Cores

IF 0.5 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Radioengineering Pub Date : 2022-09-01 DOI:10.13164/re.2022.0413

D. Krolák, P. Horský

引用次数: 1

Abstract

. This paper presents a comparative EMC susceptibility study of various integrated bandgap voltage reference cores. Conventional well-known bandgap references based on Kuijk, Brokaw and Tsividis concepts with reduced count of bipolar junction transistors in the core were analyzed. On top of the EMC susceptibility comparison, basic parameters like temperature drift, sensitivity to an operational amplifier input offset and line regulation are also discussed. The influence of a collector leakage current compensation at high temperatures is investigated as well.

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集成基带隙电压基准铁芯的电磁兼容性研究

．本文对不同集成带隙电压参考铁芯的电磁兼容磁化率进行了比较研究。分析了基于Kuijk, Brokaw和Tsividis概念的传统带隙参考，减少了双极结晶体管的核心数量。除了比较电磁兼容磁化率外，还讨论了温度漂移、对运放输入偏置的灵敏度和线路调节等基本参数。研究了高温下集电极漏电流补偿的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Radioengineering 工程技术-工程：电子与电气

CiteScore

2.00

自引率

9.10%

发文量

审稿时长

5.7 months

期刊介绍： Since 1992, the Radioengineering Journal has been publishing original scientific and engineering papers from the area of wireless communication and application of wireless technologies. The submitted papers are expected to deal with electromagnetics (antennas, propagation, microwaves), signals, circuits, optics and related fields. Each issue of the Radioengineering Journal is started by a feature article. Feature articles are organized by members of the Editorial Board to present the latest development in the selected areas of radio engineering. The Radioengineering Journal makes a maximum effort to publish submitted papers as quickly as possible. The first round of reviews should be completed within two months. Then, authors are expected to improve their manuscript within one month. If substantial changes are recommended and further reviews are requested by the reviewers, the publication time is prolonged.