Mohammad Naji Nassajfar, M. Välimäki, L. Hakola, K. Eiroma, K. Immonen, Mariam Abdulkareem, M. Horttanainen
{"title":"The effect of conductive ink alternation on the sustainability and functioning of printed electronics","authors":"Mohammad Naji Nassajfar, M. Välimäki, L. Hakola, K. Eiroma, K. Immonen, Mariam Abdulkareem, M. Horttanainen","doi":"10.1088/2058-8585/acd650","DOIUrl":null,"url":null,"abstract":"The demand for printed electronics (PE) is expected to increase for improved functionality and autonomy of products in the context of the Internet of Things, especially for sensing and communication. With this trend, the environmental performance of novel technologies is of growing importance, and researchers are exploring ways to make them more environmentally friendly using bio-based substrates and additive printing methods. Conductive inks have the highest environmental impact in the life cycle of PE, and there are two options to decrease the impact: increase recycling rates or replace commonly used silver inks with less impactful materials such as copper or graphite. With the current mixed waste management system, a higher recycling rate for silver is not achievable. Copper and graphite have a lower environmental impact than silver, however, the electrical conductivity of copper and graphite inks is lower than silver ink. This article introduces a double-parameter comparison to simultaneously assess the environmental and electrical conductivity of PE using three inks of silver, copper, and graphite inks. Then based on the technical feasibility, this study proposes suitable applications for each substrate and ink combination.","PeriodicalId":51335,"journal":{"name":"Flexible and Printed Electronics","volume":" ","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2023-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Flexible and Printed Electronics","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/2058-8585/acd650","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 1
Abstract
The demand for printed electronics (PE) is expected to increase for improved functionality and autonomy of products in the context of the Internet of Things, especially for sensing and communication. With this trend, the environmental performance of novel technologies is of growing importance, and researchers are exploring ways to make them more environmentally friendly using bio-based substrates and additive printing methods. Conductive inks have the highest environmental impact in the life cycle of PE, and there are two options to decrease the impact: increase recycling rates or replace commonly used silver inks with less impactful materials such as copper or graphite. With the current mixed waste management system, a higher recycling rate for silver is not achievable. Copper and graphite have a lower environmental impact than silver, however, the electrical conductivity of copper and graphite inks is lower than silver ink. This article introduces a double-parameter comparison to simultaneously assess the environmental and electrical conductivity of PE using three inks of silver, copper, and graphite inks. Then based on the technical feasibility, this study proposes suitable applications for each substrate and ink combination.
期刊介绍:
Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.