DESIGN AND ANALYSIS OF InP AND GaAs DOUBLE GATE MOSFET TRANSISTORS FOR LOW POWER APPLICATIONS

A. S. Geege, P. Vimala, T. S. Arun Samuel, N. Arumugam
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引用次数: 1

Abstract

This paper deals with a novel Double Gate MOSFET (DG MOSFET) which is constructed by the unification of III group materials (Indium, Gallium) and V group materials (Phosphide, Arsenide) is analyzed. Due to its short channel effect immunization, leakage current reduction and higher scaling potential, DG MOSFET as one of the most comforting devices for low power applications. In this work, we investigated the effect of DG MOSFET based on Indium Phosphide (InP) and Gallium Arsenide (GaAs) on optimal performance and drain current characteristics by replacing traditional DG MOSFET based on silicon. The transistor’s channel length is set to 20 nm. Both devices have been modeled using the NanoHub simulator and characteristics has been examined using Matlab. The descriptive analysis of characteristics has been performed through the corresponding plot structures - energy band structure, I D vs V GS characteristics, I D vs V GS characteristics, transconductance. From the results provided, it has been found that the DG MOSFET device based on InP offers ON current 10 -3 A is better than the DG MOSFET device based on Silicon and Gallium Arsenide (GaAs).
用于低功率应用的InP和GaAs双栅极MOSFET晶体管的设计与分析
本文分析了由III族材料(铟、镓)和V族材料(磷化物、砷化物)统一构成的新型双栅MOSFET (DG MOSFET)。由于其短通道效应免疫、泄漏电流减小和较高的标度电位,DG MOSFET成为低功耗应用中最舒适的器件之一。在这项工作中,我们研究了基于磷化铟(InP)和砷化镓(GaAs)的DG MOSFET取代传统的基于硅的DG MOSFET,对优化性能和漏极电流特性的影响。晶体管的通道长度设置为20nm。使用NanoHub模拟器对这两种设备进行了建模,并使用Matlab对其特性进行了检查。通过相应的图结构-能带结构、I - D vs . V - GS特性、I - D vs . V - GS特性、跨导进行了特征的描述性分析。从所提供的结果来看,基于InP的DG MOSFET器件提供的on电流为10 - 3a,优于基于硅和砷化镓(GaAs)的DG MOSFET器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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