Pulsed Power Supply Superposed with RF Oscillating Wave for the Improvement of Micro EDM Process

IF 1 Q4 ENGINEERING, MANUFACTURING

Journal of Micro and Nano-Manufacturing Pub Date : 2022-07-13 DOI:10.1115/1.4054974

Peiyao Cao, H. Tong, Yong Li

引用次数: 1

Abstract

During the micro electrical discharge machining (micro EDM) process, the dielectric property of narrow interelectrode gap is transiently changing. With the hysteretic servo motion of spindle, the effective discharge ratio (EDR) between electrodes is low. In this research, a pulsed power supply superposed with the radio-frequency (RF) oscillating wave of controllable frequency and amplitude is proposed in order to induce interelectrode continuous discharge, so that the machining efficiency and accuracy are improved simultaneously. The experimental results of micro-hole machining shows that under the oscillating frequency of 160 MHz and amplitude of ±10 V, the machining efficiency is increased by 35%, the tool electrode wear rate (TWR) remains almost unchanged, and the taper error of micro-hole is reduced by 43%. Furthermore, the process of relatively enlarging discharge gap range and increasing number of discharges after superposition is discussed, and the proper superposed oscillating amplitude is identified.

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脉冲电源与射频振荡波叠加改善微细电火花加工工艺

在微细电火花加工过程中，窄电极间隙的介电性能会发生瞬态变化。由于主轴的滞后伺服运动，电极之间的有效放电比(EDR)很低。本文提出了一种频率和幅度可控的射频振荡波叠加脉冲电源，以诱导电极间连续放电，从而提高加工效率和加工精度。微孔加工实验结果表明，在振荡频率为160 MHz、振幅为±10 V的条件下，加工效率提高35%，刀电极磨损率(TWR)基本保持不变，微孔锥度误差降低43%。进一步讨论了叠加后放电间隙范围相对增大和放电次数增加的过程，确定了合适的叠加振荡幅度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-

CiteScore

2.70

自引率

0.00%

发文量

期刊介绍： The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.