Metal Assisted Chemical Etch of Polycrystalline Silicon

IF 1 Q4 ENGINEERING, MANUFACTURING

Journal of Micro and Nano-Manufacturing Pub Date : 2022-08-30 DOI:10.1115/1.4055401

Crystal Barrera, P. Ajay, Akhila Mallavarapu, Mark Hrdy, S. V. Sreenivasan

引用次数: 0

Abstract

Metal Assisted Chemical Etching (MacEtch) of silicon shows reliable vertical anisotropic wet etching only in single-crystal silicon, which limits its applications to a small number of devices. This work extends the capabilities of MacEtch to polysilicon which has potential to enable high-volume and cost-sensitive applications such as optical metasurfaces, anodes for high capacity and flexible batteries, electrostatic supercapacitors, sensors, nanofluidic deterministic lateral displacement devices, etc. This work presents a MacEtch of polysilicon that produces nanostructure arrays with sub-50nm resolution and anisotropic profile. The three demonstrated structures are pillars of 5:1 aspect ratio and 50nm spacing for comparison to single crystal silicon MacEtch literature, pillars of 30nm spacing and a diamond pillar array with sharp corners to establish resolution limits of polysilicon MacEtch.

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金属辅助化学蚀刻多晶硅

硅的金属辅助化学蚀刻(MacEtch)仅在单晶硅上表现出可靠的垂直各向异性湿法蚀刻，这限制了其在少数器件中的应用。这项工作将MacEtch的能力扩展到多晶硅，多晶硅有潜力实现大批量和成本敏感的应用，如光学超表面、高容量和柔性电池的阳极、静电超级电容器、传感器、纳米流体确定性横向位移装置等。这项工作提出了一种多晶硅MacEtch，可以产生低于50nm分辨率和各向异性剖面的纳米结构阵列。所演示的三种结构是5:1长宽比和50nm间距的柱子(用于与单晶硅MacEtch文献进行比较)，30nm间距的柱子和具有尖角的金刚石柱阵列(用于建立多晶硅MacEtch的分辨率限制)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-

CiteScore

2.70

自引率

0.00%

发文量

期刊介绍： The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.