Fabrication of Ceramic Interposers for Module Packaging

Q4 Engineering

Journal of Microelectronics and Electronic Packaging Pub Date : 2020-04-01 DOI:10.4071/imaps.1114553

R. Alizadeh, Kaoru Porter, T. Cannon, S. Ang

引用次数: 2

Abstract

Abstract In this study, low-temperature cofired ceramic (LTCC) and 3D-printed ceramic interposers are designed and fabricated for a double-sided power electronic module. The interposer acts as elec...

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模块封装用陶瓷插入器的研制

摘要在本研究中，设计并制造了用于双面功率电子模块的低温共烧陶瓷（LTCC）和3D打印陶瓷中介层。插入器充当电子。。。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Microelectronics and Electronic Packaging Engineering-Electrical and Electronic Engineering

CiteScore

1.30

自引率

0.00%

发文量

期刊介绍： The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.