Qiao Teng , Yongkang Hu , Ran Cheng , Yongyu Wu , Guodong Zhou , Dawei Gao
{"title":"Reliability challenges in CMOS technology: A manufacturing process perspective","authors":"Qiao Teng , Yongkang Hu , Ran Cheng , Yongyu Wu , Guodong Zhou , Dawei Gao","doi":"10.1016/j.mee.2023.112086","DOIUrl":null,"url":null,"abstract":"<div><p><span>With the development of automotive electronics, the characteristics of device reliability have received widespread attention. The improvement of device reliability primarily depends on the manufacturing process's quality. This work reviews the inherent relationship between </span>manufacturing processes and reliability with a detailed introduction to the components and failure indices of wafer-level reliability testing. Furthermore, it focuses on the complementary metal-oxide-semiconductor (CMOS) manufacturing process and how device reliability can be enhanced through optimization in front-end-of-line and back-end-of-line processes. Reliability serves as a crucial indicator of device quality, and further efforts are required to achieve higher reliability through process optimization.</p></div>","PeriodicalId":18557,"journal":{"name":"Microelectronic Engineering","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2023-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronic Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S016793172300151X","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
With the development of automotive electronics, the characteristics of device reliability have received widespread attention. The improvement of device reliability primarily depends on the manufacturing process's quality. This work reviews the inherent relationship between manufacturing processes and reliability with a detailed introduction to the components and failure indices of wafer-level reliability testing. Furthermore, it focuses on the complementary metal-oxide-semiconductor (CMOS) manufacturing process and how device reliability can be enhanced through optimization in front-end-of-line and back-end-of-line processes. Reliability serves as a crucial indicator of device quality, and further efforts are required to achieve higher reliability through process optimization.
期刊介绍：
Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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