Study on Silane Coupling Agent Treated Silica Nanoparticles Filled High Performance Copper Clad Laminate

Abstract

Efforts to improve the properties of composites have involved extensive studies regarding the effective incorporation of a polymer matrix and inorganic fillers. In this work, we generated a stable organosilica sol with high concentration and high purity by surface modification with silane coupling agents, then integrated it with an epoxy matrix. The silica nanoparticle/epoxy composite exhibited improved tensile strength because of the uniform distribution of silica in the matrix, as well as the interfacial chemical bonding between polymer and silica nanoparticles; these factors resulted in effective load transfer from matrix to fillers. Additionally, the application of copper-clad laminates (CCLs) with prepreg-containing silica nanoparticles led to substantial improvements in mechanical properties, including peel strength (0.46 kgf/cm) and storage modulus (30.0 GPa), compared with conventional CCLs lacking silica nanoparticles. These results suggest that prepregs containing surface-modified silica nanoparticles have great potential for use as printed circuit board substrate materials in high-performance electronics.