Thermal Stress Analysis for High CRI LED Indoor Lighting Module

Abstract

This research is for developing a new light emitting diode (LED) indoor lighting module with high color rendering index greater than 95. When the LED is operated, electrical energy is generated and heat is released. The failing of heat dispersal degrades the performance and decreases the operating life. To manage the thermal problem effectively, several approaches have been tested in this research study. A heat sink is designed to absorb and transfer heat from the LED module. To analyze the heat flow and thermal stress of the designed LED products effectively, hexahedral mesh generation has been implemented. Heat transfer analysis was performed to find an optimal conductive material. The outcomes of this research study suggest the best material for LED products and show the result of thermal transfer simulation.