Technological prospecting: Patent mapping of bioremediation of soil contaminated with agrochemicals using fungi

IF 2.2 Q2 INFORMATION SCIENCE & LIBRARY SCIENCE
Vinícius de Matos Tavares Crecca , Joaquim Manoel da Silva , Paulo Augusto Ramalho de Souza
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引用次数: 0

Abstract

The purpose of this study was to investigate the development of biotechnologies related to the bioremediation of soil contaminated by agrochemicals using fungi through technological prospecting with patent mapping and analysis of scientific products. Due to the high complexity of biotechnologies involving microorganisms, it is observed that the state of the art is still in development, with several technological advantages already elucidated and important challenges to be overcome. Patent mapping revealed that the number of granted or pending patents showed a positive trend. In this context, a high number of patent documents were observed that describe processes and methods aimed at the preparation and application of fungi in soil bioremediation, as well as biotechnologies that use consortia of different strains of fungi or fungi and bacteria and advanced approaches involving genetic engineering. In short, it was found that inventions related to the investigated biotechnology have been protected mainly in China, the USA, Japan, and the European Union, with emphasis on the technological impact of patents in India. Finally, the findings indicated that soil bioremediation with the use of fungi presents a potential for development due to a series of technological and environmental aspects.

技术展望:利用真菌生物修复农药污染土壤的专利图谱
本研究的目的是通过技术勘探、专利制图和科学产品分析,探讨利用真菌修复农药污染土壤的相关生物技术的发展。由于涉及微生物的生物技术的高度复杂性,可以观察到,目前的技术状况仍处于发展阶段,已经阐明了一些技术优势,并需要克服重要的挑战。专利图谱显示,授权专利和待审专利数量呈上升趋势。在这种背景下,大量的专利文件描述了旨在制备和应用真菌在土壤生物修复中的过程和方法,以及使用不同菌株真菌或真菌和细菌的联合体的生物技术,以及涉及基因工程的先进方法。简而言之,研究发现,与所调查的生物技术相关的发明主要在中国、美国、日本和欧盟受到保护,而在印度,专利的技术影响受到重视。最后,研究结果表明,由于一系列技术和环境方面的原因,利用真菌进行土壤生物修复具有发展潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
World Patent Information
World Patent Information INFORMATION SCIENCE & LIBRARY SCIENCE-
CiteScore
3.50
自引率
18.50%
发文量
40
期刊介绍: The aim of World Patent Information is to provide a worldwide forum for the exchange of information between people working professionally in the field of Industrial Property information and documentation and to promote the widest possible use of the associated literature. Regular features include: papers concerned with all aspects of Industrial Property information and documentation; new regulations pertinent to Industrial Property information and documentation; short reports on relevant meetings and conferences; bibliographies, together with book and literature reviews.
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