Densification and Properties of Bimodal 316L Stainless Steel Produced by Binder Jetting Printing with Addition of B₄C.

IF 2.3 4区工程技术 Q3 ENGINEERING, MANUFACTURING

3D Printing and Additive Manufacturing Pub Date : 2024-06-18 eCollection Date: 2024-06-01 DOI:10.1089/3dp.2022.0250

Ximeng Liao, Qian Chen, Ze Zhao, Qiang Yang, Junchao Li

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引用次数: 0

Abstract

Boron-based aids are commonly introduced to tackle the unsatisfactory densification of SS316L parts fabricated by binder jetting (BJ) technology. However, there is scarce study on the effect of sintering aids on the mechanical performance. This work investigates the effect of B₄C aids and sintering temperature on the mechanical performance and microscopic morphology of BJ printing SS316L parts. SS316L powders with a bimodal size distribution were adopted to enhance density and reduce the shape distortion. Besides, B₄C was added as a sintering aid to promote densification during sintering. The results show that the bimodal powder is in favour of the density increase and the sintering process. The sintering temperature is largely reduced with the addition of B₄C. Further, the mechanical performance is mainly affected by the final density and B₄C content. In view of a comprehensive evaluation of shape retention and properties, B₄C content of 1 wt.% and sintering temperature of 1250°C are expected to be the optimal parameters.

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添加B4C的粘结剂喷射印花法制备316L双相不锈钢的致密化与性能

为了解决采用粘结剂喷射（BJ）技术制造的 SS316L 零件致密化效果不理想的问题，通常会使用硼基助剂。然而，有关烧结助剂对机械性能影响的研究却很少。本研究探讨了 B4C 助剂和烧结温度对 BJ 印刷 SS316L 零件机械性能和微观形貌的影响。采用了具有双峰尺寸分布的 SS316L 粉末，以提高密度并减少形状变形。此外，还添加了 B4C 作为烧结助剂，以促进烧结过程中的致密化。结果表明，双峰粉末有利于密度的提高和烧结过程。加入 B4C 后，烧结温度大大降低。此外，机械性能主要受最终密度和 B4C 含量的影响。从形状保持和性能的综合评估来看，1 wt.%的 B4C 含量和 1250°C 的烧结温度有望成为最佳参数。

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来源期刊

3D Printing and Additive Manufacturing Materials Science-Materials Science (miscellaneous)

CiteScore

6.00

自引率

6.50%

发文量

126

期刊介绍： 3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged. The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.