Experimental Analysis of a Voice-Coil-Driven Jetting System for Micrograms Fluid Depositions in Electronics Assembly

Abstract

Abstract The fundamental ability to drive automatically to independent locations and deposit controlled masses of electronics packaging adhesives makes dispensing an attractive solution in the electronics assembly. The existence of modern technology such as smartphones, wearable devices (watches, glasses, etc.), and tablets have led to tightly spaced, and high-density component packaging which further causes complex designs in the Printed Circuit Board (PCB) assembly. Advancements in dispensing technology because of these growing challenges in assembly has led to use of jetting systems in this new arena. The process of jetting, unlike traditional dispensing, has the ability to deposit controlled masses of packaging adhesives (also known as packaging fluids) at tightly spaced locations with high accuracy and high speed and at much higher deposition heights from the substrate. In this article, a voice-coil-driven jetting system is studied to assess the capability of jetting micrograms of electronics packagi...