A new cure kinetics model to simulate thermomechanical behavior of polymeric sealants for automotive applications

IF 3.1 Q2 MATERIALS SCIENCE, COMPOSITES
Jae-Hyuk Choi, Wonbo Shim, C. Rhie, Woong‐Ryeol Yu
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引用次数: 0

Abstract

Accurate prediction of the cure level of thermoset polymers is essential to simulate the thermomechanical behavior of polymeric thermoset sealants, which is strongly dependent on cure level. Conventional cure kinetics models, however, fail to accurately predict the cure levels of thermoset sealants subjected to a complex temperature program. Herein, we propose a new cure kinetics model that greatly enhances cure level predictability by considering temperature derivatives. The validity of our model was verified by simulating the thermomechanical behavior of a polymeric sealant using a user material subroutine (UMAT) of ABAQUS software. Experimental results from an appropriately designed thermomechanical test were compared with simulation results obtained from the UMAT.
一种新的固化动力学模型,用于模拟汽车用聚合物密封剂的热机械行为
准确预测热固性聚合物的固化水平对于模拟聚合物热固性密封剂的热机械行为至关重要,这在很大程度上取决于固化水平。然而,传统的固化动力学模型无法准确预测受到复杂温度程序影响的热固性密封剂的固化水平。在此,我们提出了一种新的固化动力学模型,通过考虑温度导数大大提高了固化水平的可预测性。通过使用ABAQUS软件的用户材料子程序(UMAT)模拟聚合物密封剂的热机械行为,验证了我们模型的有效性。将来自适当设计的热机械测试的实验结果与从UMAT获得的模拟结果进行比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Functional Composites and Structures
Functional Composites and Structures Materials Science-Materials Science (miscellaneous)
CiteScore
4.80
自引率
10.70%
发文量
33
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