Interface Microstructure Welded by Ultrasonic Welding

C. Iwamoto
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Abstract

Ultrasonic welding is widely used as one of the excellent solid-state weldings. However, the mechanism of the welding has not been clarified enough. This report discussed the welding mechanism of advanced Mg alloys, and the Cu multi-wire and the substrate based on the microstructure investigation. Development of in-situ TEM observation technique for ultrasonic welding was reported as well, and nanoparticle
超声焊接界面显微组织
超声波焊接作为一种优良的固态焊接方法,得到了广泛的应用。然而,焊接的机理还不够清楚。本文在微观组织研究的基础上,探讨了先进镁合金、Cu复合丝与基体的焊接机理。本文还报道了超声焊接现场透射电镜观察技术的发展
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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