The assembly of a noncanonical LINC complex in Saccharomyces cerevisiae.

IF 1.8 4区 生物学 Q3 GENETICS & HEREDITY
Current Genetics Pub Date : 2022-02-01 Epub Date: 2021-11-15 DOI:10.1007/s00294-021-01220-0
Jinbo Fan, Zhuo Sun, Yang Wang
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引用次数: 2

Abstract

The linker of nucleoskeleton and cytoskeleton (LINC) complex is a protein complex across the nuclear envelope and has maintained its general assembly mode throughout evolution. SUN and KASH proteins, which are the major components of LINC complex, interact with each other in the nuclear lumen to transmit forces across the nuclear envelope and have diverse functions. However, research of LINC complex in budding yeast has been limited due to the lack of identification of a canonical KASH protein and a cytoskeleton factor. Here, we review recent findings that addressed these puzzles in budding yeast. We highlight the distinct assembly model of the telomere-associated LINC complex in budding yeast, which could be beneficial for identifying LINC variants in other eukaryotes.

酿酒酵母中非典型LINC复合物的组装。
核骨架和细胞骨架(LINC)复合物是一种跨越核膜的蛋白质复合物,在整个进化过程中一直保持其一般组装模式。SUN蛋白和KASH蛋白是LINC复合物的主要组成部分,它们在核腔内相互作用,在核膜上传递力,具有多种功能。然而,由于缺乏典型的KASH蛋白和细胞骨架因子的鉴定,对出芽酵母中LINC复合物的研究受到限制。在这里,我们回顾了最近的发现,解决了这些谜题在出芽酵母。我们强调了端粒相关的LINC复合物在出芽酵母中独特的组装模式,这可能有助于识别其他真核生物中的LINC变异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Current Genetics
Current Genetics 生物-遗传学
CiteScore
6.00
自引率
0.00%
发文量
34
审稿时长
1 months
期刊介绍: Current Genetics publishes genetic, genomic, molecular and systems-level analysis of eukaryotic and prokaryotic microorganisms and cell organelles. All articles are peer-reviewed. The journal welcomes submissions employing any type of research approach, be it analytical (aiming at a better understanding), applied (aiming at practical applications), synthetic or theoretical. Current Genetics no longer accepts manuscripts describing the genome sequence of mitochondria/chloroplast of a small number of species. Manuscripts covering sequence comparisons and analyses that include a large number of species will still be considered.
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