Flexible Ti3C2T x /(Aramid Nanofiber/PVA) Composite Films for Superior Electromagnetic Interference Shielding.

IF 10.7
Research (Washington, D.C.) Pub Date : 2022-02-02 eCollection Date: 2022-01-01 DOI:10.34133/2022/9780290
Yali Zhang, Zhonglei Ma, Kunpeng Ruan, Junwei Gu
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引用次数: 34

Abstract

Multifunctional electromagnetic interference (EMI) shielding materials would solve electromagnetic radiation and pollution problems from electronic devices. Herein, the directional freeze-drying technology is utilized to prepare the aramid nanofiber/polyvinyl alcohol aerogel with a directionally porous structure (D-ANF/PVA), and the Ti3C2T x dispersion is fully immersed into the D-ANF/PVA aerogel via ultrasonication and vacuum-assisted impregnation. Ti3C2T x /(ANF/PVA) EMI shielding composite films with directionally ordered structure (D-Ti3C2T x /(ANF/PVA)) are then prepared by freeze-drying and hot pressing. Constructing a directionally porous structure enables the highly conductive Ti3C2T x nanosheets to be wrapped on the directionally porous D-ANF/PVA framework in order arrangement and overlapped with each other. And the hot pressing process effectively reduces the layer spacing between the stacked wavy D-ANF/PVA, to form a large number of Ti3C2T x -Ti3C2T x continuous conductive paths, which significantly improves the conductivity of the D-Ti3C2T x /(ANF/PVA) EMI shielding composite film. When the amount of Ti3C2T x is 80 wt%, the EMI shielding effectiveness (EMI SE) and specific SE (SSE/t) of D-Ti3C2T x /(ANF/PVA) EMI shielding composite film achieve 70 dB and 13790 dB·cm2·g-1 (thickness and density of 120 μm and 0.423 g·cm-3), far superior to random-structured Ti3C2T x /(ANF/PVA) (R-Ti3C2T x /(ANF/PVA)) composite film (46 dB and 9062 dB·cm2·g-1, respectively) via blending-freeze-drying followed by hot pressing technology. Meanwhile, the D-Ti3C2T x /(ANF/PVA) EMI shielding composite film possesses excellent flexibility and foldability.

Abstract Image

Abstract Image

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柔性Ti3C2Tx/(芳族聚酰胺纳米纤维/PVA)复合薄膜,用于卓越的电磁干扰屏蔽。
多功能电磁干扰屏蔽材料将解决电子设备的电磁辐射和污染问题。本文利用定向冷冻干燥技术制备定向多孔结构的芳纶纳米纤维/聚乙烯醇气凝胶(D-ANF/PVA),并通过超声波和真空辅助浸渍将ti3c2tx分散体完全浸入D-ANF/PVA气凝胶中。然后通过冻干和热压制备了定向有序结构的Ti3C2T x /(ANF/PVA)电磁干扰屏蔽复合膜(D-Ti3C2T x /(ANF/PVA))。通过构建定向多孔结构,使得高导电性ti3c2tx纳米片能够有序地包裹在定向多孔的D-ANF/PVA骨架上并相互重叠。并且热压工艺有效减小了堆叠波状D-ANF/PVA之间的层间距,形成大量Ti3C2T x -Ti3C2T x连续导电路径,显著提高了D-Ti3C2T x /(ANF/PVA) EMI屏蔽复合膜的导电性。当ti3c2tx用量为80 wt%时,d - ti3c2tx /(ANF/PVA)复合膜的EMI屏蔽效能(EMI SE)和比SE (SSE/t)分别达到70 dB和13790 dB·cm2·g-1(厚度和密度分别为120 μm和0.423 g·cm-3),远优于随机结构ti3c2tx /(ANF/PVA) (r - ti3c2tx /(ANF/PVA))复合膜(分别为46 dB和9062 dB·cm2·g-1)。同时,d - ti3c2tx /(ANF/PVA)电磁干扰屏蔽复合膜具有优异的柔韧性和可折叠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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