Electrodeposited NiFe2O4/Cu2O heterostructure thin films with enhanced photocurrent generation

IF 3.261
Samba Siva Vadla , Sruthi Guru , Tripta Parida , Subish John , Somnath C. Roy , G. Ranga Rao
{"title":"Electrodeposited NiFe2O4/Cu2O heterostructure thin films with enhanced photocurrent generation","authors":"Samba Siva Vadla ,&nbsp;Sruthi Guru ,&nbsp;Tripta Parida ,&nbsp;Subish John ,&nbsp;Somnath C. Roy ,&nbsp;G. Ranga Rao","doi":"10.1016/j.jpap.2023.100181","DOIUrl":null,"url":null,"abstract":"<div><p>In comparison with single-phase materials, heterostructures have been known for superior water splitting applications. In this study, Cu<sub>2</sub>O and NiFe<sub>2</sub>O<sub>4</sub> are chosen to fabricate thin film heterostructures. Cu<sub>2</sub>O is electrodeposited at 60 °C for 5 min on ITO-coated glass substrates using three-electrode system. After deposition, the phase formation is confirmed using powder x-ray diffraction studies. The NiFe<sub>2</sub>O<sub>4</sub> (NFO) thin films are deposited using RF sputtering method at room temperature for 2 h on Cu<sub>2</sub>O/ITO substrates to obtain NFO/Cu<sub>2</sub>O/ITO Type-II heterostructure. The scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM) cross-sectional images show that the thickness of NFO layer is 120 nm and Cu<sub>2</sub>O layer is 1.5 µm. The photocurrent density of Cu<sub>2</sub>O on ITO is 0.08 ± 0.002 mA/cm<sup>2</sup>, and it increased to 0.12 ± 0.002 mA/cm<sup>2</sup> after adding NFO layer on Cu<sub>2</sub>O film due to Type-II heterojunction formation.</p></div>","PeriodicalId":375,"journal":{"name":"Journal of Photochemistry and Photobiology","volume":"15 ","pages":"Article 100181"},"PeriodicalIF":3.2610,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Photochemistry and Photobiology","FirstCategoryId":"2","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2666469023000222","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In comparison with single-phase materials, heterostructures have been known for superior water splitting applications. In this study, Cu2O and NiFe2O4 are chosen to fabricate thin film heterostructures. Cu2O is electrodeposited at 60 °C for 5 min on ITO-coated glass substrates using three-electrode system. After deposition, the phase formation is confirmed using powder x-ray diffraction studies. The NiFe2O4 (NFO) thin films are deposited using RF sputtering method at room temperature for 2 h on Cu2O/ITO substrates to obtain NFO/Cu2O/ITO Type-II heterostructure. The scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM) cross-sectional images show that the thickness of NFO layer is 120 nm and Cu2O layer is 1.5 µm. The photocurrent density of Cu2O on ITO is 0.08 ± 0.002 mA/cm2, and it increased to 0.12 ± 0.002 mA/cm2 after adding NFO layer on Cu2O film due to Type-II heterojunction formation.

Abstract Image

电沉积NiFe2O4/Cu2O异质结构薄膜,增强光电流产生
与单相材料相比,异质结构具有优越的水裂解应用。本研究选用Cu2O和NiFe2O4制备薄膜异质结构。Cu2O在60°C下电沉积5分钟,使用三电极系统在ito涂层玻璃基板上。沉积后,用粉末x射线衍射研究证实了相的形成。采用射频溅射法制备了NiFe2O4 (NFO)薄膜,在Cu2O/ITO衬底上室温沉积2h,得到了NFO/Cu2O/ITO ii型异质结构。扫描电镜(SEM)和高分辨率透射电镜(HRTEM)截面图显示,NFO层厚度为120 nm, Cu2O层厚度为1.5µm。Cu2O在ITO上的光电流密度为0.08±0.002 mA/cm2,在Cu2O膜上添加NFO层后,由于ii型异质结的形成,其光电流密度增加到0.12±0.002 mA/cm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
4.10
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信