Highly Sensitive Temperature Sensor Based on Coupled-Beam AlN-on-Si MEMS Resonators Operating in Out-of-Plane Flexural Vibration Modes.

IF 10.7
Research (Washington, D.C.) Pub Date : 2022-08-20 eCollection Date: 2022-01-01 DOI:10.34133/2022/9865926
Cheng Tu, Ming-Hong Yang, Zi-Qiang Zhang, Xiu-Mei Lv, Lei Li, Xiao-Sheng Zhang
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引用次数: 5

Abstract

This paper reports a type of highly sensitive temperature sensor utilizing AlN-on-Si resonators with coupled-beam structures of double- and triple-ended-tuning-fork (D/TETF). For both resonators, the out-of-plane flexural mode is adopted as it favors the effect of thermal mismatch between the composite layers inherent to the AlN-on-Si structure and thus helps attain a large temperature coefficient of resonant frequency (TCF). The analytical model to calculate TCF values of D/TETF AlN-on-Si resonators is provided, which agrees well with the finite-element simulation and experimental results. The resonant temperature sensor is built by closing the loop of the AlN-on-Si resonator, a transimpedance amplifier, a low-pass filter, and a phase shifter to form an oscillator, the output frequency of which shifts proportionally to the ambient temperature. The measured sensitivities of the temperature sensors using D/TETF resonators are better than -1000 ppm/°C in the temperature range of 25°C~60°C, showing great potential to fulfill the on-chip temperature compensation scheme for cofabricated sensors.

Abstract Image

Abstract Image

Abstract Image

基于耦合梁AlN-on-Si MEMS谐振器的面外弯曲振动高灵敏度温度传感器。
本文报道了一种采用双端和三端音叉(D/TETF)耦合梁结构的铝硅谐振器的高灵敏度温度传感器。对于两种谐振器,均采用面外弯曲模式,因为它有利于AlN-on-Si结构固有的复合层之间的热失配效应,从而有助于获得较大的谐振频率温度系数(TCF)。给出了计算D/TETF铝硅谐振腔TCF值的解析模型,该模型与有限元模拟和实验结果吻合较好。谐振温度传感器是通过闭合硅铝谐振器、跨阻放大器、低通滤波器和移相器的环路来构建的,该振荡器的输出频率与环境温度成比例地变化。在25°C~60°C的温度范围内,使用D/TETF谐振器的温度传感器的测量灵敏度优于-1000 ppm/°C,显示出实现芯片上温度补偿方案的巨大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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