Self-healable functional polymers and polymer-based composites

IF 26 1区 化学 Q1 POLYMER SCIENCE
Ze Ping Zhang, Min Zhi Rong, Ming Qiu Zhang
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引用次数: 2

Abstract

Polymers and polymer composites with advanced functions have attracted great attention following the development of modern science and technologies. Nevertheless, damages of microstructures and variations of chemical constitutes are inevitably induced during their manufacturing and operation, causing undesired attenuation or even loss of functionalities. To address the problems, self-healable functional polymeric materials, which focus on autonomous restoration of non-structural functionalities for improving the lifespan and durability, have emerged in recent years as a huge surge of interest because of their apparent potential benefits. As dictated by the diverse working principles of the individual functionalities, the technical advance of self-healing functional polymers and composites exhibits distinct characteristics from that of self-healing structural materials specializing in strength recovery. This review summarizes the state-of-the-art achievements in the field, and discusses the common features and issues in most of the reported self-healing functional materials including healable electroconductive, thermally conductive, dielectric, optically transparent, superhydrophobic, superhydrophilic, and power conversion and storage related polymers. The review will subsequently discuss (i) the damage modes relating to different causes, (ii) the mechanisms of self-healing based on chemical and physical methodologies, and (iii) molecular level design schemes and synthesis strategies for self-healing functional polymeric materials. The advantages and inadequacies of representative works are discussed, and the critical challenges and opportunities for future research are highlighted. It is hoped that the present article would inspire more innovative explorations of self-healing functional polymeric materials, as well as promote their practical application.

Abstract Image

自愈功能聚合物和聚合物基复合材料
随着现代科学技术的发展,具有先进功能的聚合物和聚合物复合材料受到了人们的广泛关注。然而,在其制造和使用过程中,不可避免地会引起微结构的破坏和化学成分的变化,从而导致不希望的衰减甚至丧失功能。为了解决这些问题,近年来,由于具有明显的潜在优势,自修复功能聚合物材料引起了人们的极大兴趣。自修复功能聚合物材料专注于非结构功能的自动修复,以提高使用寿命和耐久性。由于单个功能的不同工作原理,自修复功能聚合物和复合材料的技术进步与专门从事强度恢复的自修复结构材料表现出截然不同的特征。本文综述了该领域的最新研究成果,讨论了目前报道的自修复功能材料的共同特点和存在的问题,包括可修复的导电、导热、介电、光学透明、超疏水、超亲水性以及与能量转换和存储相关的聚合物。随后将讨论(i)与不同原因相关的损伤模式,(ii)基于化学和物理方法的自修复机制,以及(iii)自修复功能聚合物材料的分子水平设计方案和合成策略。讨论了代表性作品的优点和不足,并强调了未来研究的关键挑战和机遇。希望本文的研究成果能够启发人们对自修复功能高分子材料进行更多的创新探索,并促进其实际应用。
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来源期刊
Progress in Polymer Science
Progress in Polymer Science 化学-高分子科学
CiteScore
48.70
自引率
1.10%
发文量
54
审稿时长
38 days
期刊介绍: Progress in Polymer Science is a journal that publishes state-of-the-art overview articles in the field of polymer science and engineering. These articles are written by internationally recognized authorities in the discipline, making it a valuable resource for staying up-to-date with the latest developments in this rapidly growing field. The journal serves as a link between original articles, innovations published in patents, and the most current knowledge of technology. It covers a wide range of topics within the traditional fields of polymer science, including chemistry, physics, and engineering involving polymers. Additionally, it explores interdisciplinary developing fields such as functional and specialty polymers, biomaterials, polymers in drug delivery, polymers in electronic applications, composites, conducting polymers, liquid crystalline materials, and the interphases between polymers and ceramics. The journal also highlights new fabrication techniques that are making significant contributions to the field. The subject areas covered by Progress in Polymer Science include biomaterials, materials chemistry, organic chemistry, polymers and plastics, surfaces, coatings and films, and nanotechnology. The journal is indexed and abstracted in various databases, including Materials Science Citation Index, Chemical Abstracts, Engineering Index, Current Contents, FIZ Karlsruhe, Scopus, and INSPEC.
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