Microthermoforming as a novel technique for manufacturing scaffolds in tissue engineering (CellChips).

S Giselbrecht, T Gietzelt, E Gottwald, A E Guber, C Trautmann, R Truckenmüller, K F Weibezahn
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引用次数: 37

Abstract

The CellChip is a microstructured polymer scaffold, which favours a three-dimensional cultivation of cells within an array of cubic microcontainers. The manufacturing process used so far is microinjection moulding combined with laser-based perforation. In a first attempt to simplify the process, costly perforation was avoided by using commercially available, inexpensive microfiltration membranes for the bottom of the microcavities. Microthermoforming is a promising novel technique which allows the CellChip to be produced from thin film. Working pressures of approximately 4000 kPa were required for the adequate moulding of 50 microm thick films from three different polymers (polystyrene, polycarbonate, cyclo-olefin polymer). Integrating drafts and chamfers in micromoulds is not going to eliminate an uneven thickness profile, but reduces demoulding forces. Microthermoformed CellChips of polycarbonate were perforated by an ion track technique to guarantee a sufficient supply of medium and gases to the cells. The prestructured CellChips were irradiated with 1460 MeV xenon ions at a fluence of a few 10(6) ions/cm2. The tracks were etched in an aqueous solution of 5 N NaOH at 30 degrees C, which resulted in cylindrical pores approximately 2 microm in diameter. Microinjection-moulded, membrane-bonded and thermoformed CellChips were subjected to comparative examination for viability in a cell culture experiment with parenchymal liver cells (HepG2). The cells stayed viable over a period of more than 20 days. No significant differences in viability between injection-moulded, membrane-bonded, and thermoformed CellChips were observed.

微热成型是组织工程(CellChips)中制造支架的一种新技术。
细胞芯片是一种微结构聚合物支架,它有利于在立方微容器阵列中进行细胞的三维培养。目前使用的制造工艺是微注射成型与激光穿孔相结合。在简化工艺的第一次尝试中,通过在微腔底部使用市售的廉价微滤膜,避免了昂贵的穿孔。微热成型是一种很有前途的新技术,它可以从薄膜中生产出细胞芯片。用三种不同的聚合物(聚苯乙烯、聚碳酸酯、环烯烃聚合物)制成50微米厚的薄膜,需要大约4000千帕的工作压力。在微模中集成草稿和倒角并不能消除不均匀的厚度轮廓,但可以减少脱模力。微热成型聚碳酸酯细胞芯片采用离子径迹技术穿孔,以保证细胞有足够的介质和气体供应。用1460 MeV的氙离子以10(6)个离子/cm2照射预结构细胞芯片。径迹在5 N NaOH水溶液中蚀刻,温度为30℃,形成直径约为2微米的圆柱形孔。在实质肝细胞(HepG2)的细胞培养实验中,对微注射成型、膜结合和热成型的细胞芯片的活力进行了比较检查。这些细胞在20多天的时间里保持了活力。注射成型、膜结合和热成型细胞芯片之间的活力没有显著差异。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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