Cleavage and deprotection of peptide resins using chloro- and bromotrialkylsilanes.

Peptide research Pub Date : 1995-09-01
J L Hughes, E J Leopold
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引用次数: 0

Abstract

The cleavage of a peptide resin attached to a phenylacetomidomethyl (PAM) resin was investigated using bromotrimethylsilane (TMSBr) with thioanisole in trifluoroacetic acid (TFA), and by chlorotrimethylsilane (TMSCl) in the same reagents with lithium bromide. Both TMSBr and TMSCl cleaved the peptide from the resin, but TMSCl required elevated temperature (50 degrees C) to effect the cleavage. Procedures were investigated for the deprotection and cleavage of either N(g)-tosyl (Tos)- or mesitylenesulfonyl (MTS)-arginine residues attached to 4-methylbenzylhydrylamine (MBHA) resin, and of a peptide containing an MTS-arginine residue attached to MBHA resin, using either TMSCl or TMSBr as cleavage reagents. The MTS group is cleanly removed from arginine using TMSBr with thioanisole in TFA and by TMSCl in the same reagents with lithium bromide.

氯基和溴基三烷基硅烷对肽树脂的裂解和脱保护。
研究了溴三甲基硅烷(TMSBr)与硫异唑在三氟乙酸(TFA)溶液中,以及氯三甲基硅烷(TMSCl)与溴化锂在相同试剂中对附着在苯乙酰胺多甲基(PAM)树脂上的肽树脂的裂解作用。TMSBr和TMSCl都能将肽从树脂中切割出来,但TMSCl需要提高温度(50℃)才能达到切割效果。采用TMSCl或TMSBr作为裂解试剂,研究了N(g)-tosyl (Tos)-或亚甲基磺酰(MTS)-精氨酸残基与4-甲基苯基水合胺(MBHA)树脂的脱保护和裂解过程,以及含有MTS-精氨酸残基的肽与MBHA树脂的脱保护和裂解过程。用TMSBr和硫代异唑在TFA中,用TMSCl在相同的试剂中与溴化锂一起,从精氨酸中清除MTS基团。
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