{"title":"Polymer-Metal Composites and Their Applications in Microelectronics","authors":"Qi Xia, Yan Peng, Jiuyang Zhang","doi":"10.1016/j.polymer.2026.130951","DOIUrl":null,"url":null,"abstract":"<div><div>Polymer-metal composites (PMCs) combine the electrical and thermal functionality of metallic fillers with the flexibility, processability, and structural tunability of polymer matrices, offering promising solutions for advanced microelectronic systems. However, the relationships among PMC structure, mechanisms, material properties, and application requirements remain insufficiently discussed. This review focuses on PMCs for microelectronic applications and examines how polymer matrices, metallic fillers, interfaces, and network structures influence electrical, thermal, mechanical, and electromagnetic properties and their device applications. The electrical and thermal transport mechanisms, material systems, and preparation processes are summarized, followed by discussions of electronic packaging and interconnects, thermal management, electromagnetic interference shielding, and printed and flexible electronics. An application-driven benchmark evaluation is further introduced to compare representative PMC performance with relevant engineering requirements, identify performance gaps, and discuss corresponding material and structural strategies. Finally, the development directions are discussed from the perspectives of interface engineering, multiscale network construction, advanced manufacturing, and multifunctional integration, providing a reference for the application-oriented design and development of PMCs for microelectronics.</div></div><div>Polymer-metal composites (PMCs) combine the electrical and thermal functionality of metallic fillers with the flexibility, processability, and structural tunability of polymer matrices, offering promising solutions for advanced microelectronic systems. However, the relationships among PMC structure, mechanisms, material properties, and application requirements remain insufficiently discussed. This review focuses on PMCs for microelectronic applications and examines how polymer matrices, metallic fillers, interfaces, and network structures influence electrical, thermal, mechanical, and electromagnetic properties and their device applications. The electrical and thermal transport mechanisms, material systems, and preparation processes are summarized, followed by discussions of electronic packaging and interconnects, thermal management, electromagnetic interference shielding, and printed and flexible electronics. An application-driven benchmark evaluation is further introduced to compare representative PMC performance with relevant engineering requirements, identify performance gaps, and discuss corresponding material and structural strategies. Finally, the development directions are discussed from the perspectives of interface engineering, multiscale network construction, advanced manufacturing, and multifunctional integration, providing a reference for the application-oriented design and development of PMCs for microelectronics.</div><div>Polymer–metal composites combine tailored polymer matrices, metallic fillers, interfaces, and network structures to regulate electrical, thermal, mechanical, and electromagnetic properties for microelectronic applications.<span><figure><span><img><ol><li><span><span>Download: <span>Download high-res image (374KB)</span></span></span></li><li><span><span>Download: <span>Download full-size image</span></span></span></li></ol></span></figure></span></div>","PeriodicalId":405,"journal":{"name":"Polymer","volume":"367 ","pages":"Article 130951"},"PeriodicalIF":5.1000,"publicationDate":"2026-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032386126013984","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
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Abstract
Polymer-metal composites (PMCs) combine the electrical and thermal functionality of metallic fillers with the flexibility, processability, and structural tunability of polymer matrices, offering promising solutions for advanced microelectronic systems. However, the relationships among PMC structure, mechanisms, material properties, and application requirements remain insufficiently discussed. This review focuses on PMCs for microelectronic applications and examines how polymer matrices, metallic fillers, interfaces, and network structures influence electrical, thermal, mechanical, and electromagnetic properties and their device applications. The electrical and thermal transport mechanisms, material systems, and preparation processes are summarized, followed by discussions of electronic packaging and interconnects, thermal management, electromagnetic interference shielding, and printed and flexible electronics. An application-driven benchmark evaluation is further introduced to compare representative PMC performance with relevant engineering requirements, identify performance gaps, and discuss corresponding material and structural strategies. Finally, the development directions are discussed from the perspectives of interface engineering, multiscale network construction, advanced manufacturing, and multifunctional integration, providing a reference for the application-oriented design and development of PMCs for microelectronics.
Polymer-metal composites (PMCs) combine the electrical and thermal functionality of metallic fillers with the flexibility, processability, and structural tunability of polymer matrices, offering promising solutions for advanced microelectronic systems. However, the relationships among PMC structure, mechanisms, material properties, and application requirements remain insufficiently discussed. This review focuses on PMCs for microelectronic applications and examines how polymer matrices, metallic fillers, interfaces, and network structures influence electrical, thermal, mechanical, and electromagnetic properties and their device applications. The electrical and thermal transport mechanisms, material systems, and preparation processes are summarized, followed by discussions of electronic packaging and interconnects, thermal management, electromagnetic interference shielding, and printed and flexible electronics. An application-driven benchmark evaluation is further introduced to compare representative PMC performance with relevant engineering requirements, identify performance gaps, and discuss corresponding material and structural strategies. Finally, the development directions are discussed from the perspectives of interface engineering, multiscale network construction, advanced manufacturing, and multifunctional integration, providing a reference for the application-oriented design and development of PMCs for microelectronics.
Polymer–metal composites combine tailored polymer matrices, metallic fillers, interfaces, and network structures to regulate electrical, thermal, mechanical, and electromagnetic properties for microelectronic applications.
期刊介绍：
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.
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