Modulation of interfacial behavior and properties of Sn-58Bi/Cu solder joints by micron-scale indium addition

IF 6.2 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2026-10-01 Epub Date: 2026-10-03 DOI:10.1016/j.matchar.2026.117157

Lei Sun, Peng He, Shuye Zhang, Jing Wang, Liang Zhang

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引用次数: 0

Abstract

In this work, trace amounts of micron-scale indium (In) particles were incorporated into Sn58Bi solder, and the modulation of interfacial behavior and properties of solder joints induced by In particles was systematically investigated. Adding a small amount of In particles to Sn58Bi solder changed its melting temperature. When the In mass fraction was 0.3 wt%, the peak temperature of the solder decreased from the initial 141.22 °C to 140.97 °C. With the addition of micron-scale In particles, the interfacial intermetallic compound of the solder joints transformed from Cu₆Sn₅ to the more stable Cu₆(Sn,In)₅ phase, and its thickness also increased. At an In particles mass fraction of 0.3 wt%, the interfacial layer thickness increased from 1.83 μm to 2.23 μm. In particles modification homogenized and regularized the orientation of Cu₆(Sn,In)₅ grains, which exhibited a dominant preferred growth orientation along the (001) crystallographic direction. In addition, the solubilization of indium in the Sn matrix led to microstructure refinement of the solder joint, which raised the shear strength of Sn-58Bi-0.3In solder joints from 39.2 MPa to 41.8 MPa. Regarding the wettability of the solder joint, the spreading area of the Sn58Bi solder joint without In particles was 78.14 mm². A maximum spreading area of 90.05 mm² was obtained when the In mass fraction reached 0.3 wt%. When the In proportion was further raised, a decline could be observed in the spreading area.

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微米尺度添加铟对Sn-58Bi/Cu焊点界面行为和性能的调制

本研究将微量微米级铟（In）颗粒掺入Sn58Bi焊料中，系统研究了In颗粒对焊点界面行为和性能的影响。在Sn58Bi焊料中加入少量的In颗粒可以改变其熔化温度。当In质量分数为0.3 wt%时，焊料的峰值温度从141.22℃降至140.97℃。随着微米级In颗粒的加入，焊点界面金属间化合物由Cu6Sn5转变为更稳定的Cu6(Sn,In)5相，其厚度也有所增加。In颗粒质量分数为0.3 wt%时，界面层厚度从1.83 μm增加到2.23 μm。在颗粒改性中，Cu6(Sn,In)5晶粒的取向均匀化和规整化，表现出沿（001）晶学方向的优先生长取向。此外，铟在锡基体中的溶解作用使焊点组织细化，Sn- 58bi -0.3In焊点的抗剪强度由39.2 MPa提高到41.8 MPa。在焊点润湿性方面，无In颗粒Sn58Bi焊点的扩散面积为78.14 mm2。In质量分数为0.3 wt%时，扩散面积最大达90.05 mm2。随着比例的进一步提高，铺展面积呈下降趋势。

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.