{"title":"Effect of annealing atmosphere on the microstructure and properties of Hf-doped BiFeO3 thin films","authors":"Shuhui Sun, Yujie Xu, Haixia Zhang, Zhenfeng Jing, Sen Zhang, Xingfu Li, Quanxin Guo, Haoyu Shi, Jing Li, Fengqing Zhang","doi":"10.1007/s10854-026-18509-w","DOIUrl":null,"url":null,"abstract":"<div><p>BiFe<sub>1−X</sub>Hf<sub>X</sub>O<sub>3</sub> (X = 1.2 mol%, abbreviated as BFHO) thin films were deposited on ITO/glass substrates using the sol–gel method and subsequently post-annealed in O<sub>2</sub>, air, and N<sub>2</sub> atmospheres, respectively. This study systematically investigates the effects of different annealing atmospheres on the microstructure, defect chemistry, and electrical properties of BFHO thin films, with particular emphasis on the correlations among oxygen vacancy concentration, ferroelectric behavior, leakage current characteristics, conduction mechanisms, dielectric properties, and aging behavior. The results demonstrate that films annealed in an O<sub>2</sub> atmosphere exhibit the best crystallinity and most well-developed grain morphology, along with the lowest concentrations of Fe<sup>2+</sup> ions and oxygen vacancies. Owing to the effective suppression of defects, the O<sub>2</sub>-annealed films show significantly enhanced ferroelectric performance and the lowest leakage current density. Leakage current analysis reveals that Fowler–Nordheim (F–N) tunneling is the dominant conduction mechanism. Furthermore, a theoretical aging model based on the volumetric effect is developed to provide insight into the physical mechanism underlying the aging behavior of BFHO thin films. Compared to films annealed in air and nitrogen, the oxygen-annealed films exhibit the smallest degree of aging and demonstrate excellent electrical stability.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"37 29","pages":""},"PeriodicalIF":3.2000,"publicationDate":"2026-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-026-18509-w","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
BiFe1−XHfXO3 (X = 1.2 mol%, abbreviated as BFHO) thin films were deposited on ITO/glass substrates using the sol–gel method and subsequently post-annealed in O2, air, and N2 atmospheres, respectively. This study systematically investigates the effects of different annealing atmospheres on the microstructure, defect chemistry, and electrical properties of BFHO thin films, with particular emphasis on the correlations among oxygen vacancy concentration, ferroelectric behavior, leakage current characteristics, conduction mechanisms, dielectric properties, and aging behavior. The results demonstrate that films annealed in an O2 atmosphere exhibit the best crystallinity and most well-developed grain morphology, along with the lowest concentrations of Fe2+ ions and oxygen vacancies. Owing to the effective suppression of defects, the O2-annealed films show significantly enhanced ferroelectric performance and the lowest leakage current density. Leakage current analysis reveals that Fowler–Nordheim (F–N) tunneling is the dominant conduction mechanism. Furthermore, a theoretical aging model based on the volumetric effect is developed to provide insight into the physical mechanism underlying the aging behavior of BFHO thin films. Compared to films annealed in air and nitrogen, the oxygen-annealed films exhibit the smallest degree of aging and demonstrate excellent electrical stability.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.