Structural inheritance and transport response in MOCVD/PA-MBE regrowth of AlGaN/GaN heterostructures on GaN/sapphire and thin-buffer SiC/Si templates

IF 3.2 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
P. V. Seredin, N. S. Buylov, D. L. Goloshchapov, A. M. Mizerov, Y. A. Peshkov, Sh. Sh. Sharofidinov, E. V. Nikitina, S. N. Timoshnev
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引用次数: 0

Abstract

In this study, the process of forming a nanometer-scale active region via plasma-assisted molecular beam epitaxy (PA-MBE) with nitrogen plasma activation was applied to two distinctly different nitride template architectures. These templates were initially fabricated by the metal–organic chemical vapor deposition (MOCVD) method and served as controlled materials science probes to investigate the inheritance of the structural state of the original buffer during the subsequent regrowth of AlGaN/GaN heterostructures. A conventional GaN/c–Al2O3 template with an MOCVD-GaN buffer approximately 1.5 μm thick was compared to a significantly thinner Al0.1Ga0.9N/AlN/SiC/Si(111) template. On both templates, a nominally identical active sequence—AlN/GaN/AlN/AlGaN/GaN—was formed. The structures were characterized using Hall measurements, scanning electron microscopy (SEM), transmission electron microscopy (TEM), atomic force microscopy (AFM), X-ray diffraction/reciprocal space mapping (XRD/RSM), X-ray reflectivity (XRR), Raman spectroscopy, and photoluminescence. The results demonstrate a pronounced inheritance of the initial architecture. The reference GaN/sapphire template exhibited a more uniform morphology, narrower diffraction distributions, a higher XRD-estimated lateral coherence length (~ 130 versus ~ 41 nm), and a lower volume-averaged biaxial stress (~ 0.55 versus ~ 3–4 GPa). Cross-sectional TEM of the SiC/Si template directly revealed contrast from extended defects traced from the MOCVD-AlGaN layer through the MOCVD/PA-MBE interface into the PA-MBE-GaN layer, whereas the structure on GaN/sapphire showed a more uniform microstructure in the active region. Raman spectroscopy further indicated a structurally inhomogeneous conversion SiC interlayer with contributions characteristic of several SiC polytypes. At room temperature, Hall measurements showed effective sheet electron concentrations of approximately 3–4 × 1013 cm−2 for both structures, with effective mobilities of about 510 and 690 cm2/(V·s) for the SiC/Si and GaN/sapphire templates, respectively. Since Hall data alone cannot exclude parallel conduction in GaN or at the regrowth interface, the measured sheet concentration is not interpreted as the definitive concentration of a single two-dimensional electron gas (2DEG) channel. Meanwhile, the thin-buffer SiC/Si template retains about 74% of the effective Hall mobility of the thick-buffer GaN/sapphire reference. Overall, the data indicate that the inherited inhomogeneity of the initial SiC/Si architecture significantly contributes to the observed structural limitations and suggests specific directions for further optimization.

在GaN/蓝宝石和薄缓冲SiC/Si模板上MOCVD/PA-MBE再生AlGaN/GaN异质结构的结构遗传和传输响应
在本研究中,通过等离子体辅助分子束外延(PA-MBE)和氮等离子体活化形成纳米级活性区域的过程应用于两种截然不同的氮化模板结构。这些模板最初是通过金属有机化学气相沉积(MOCVD)方法制备的,并作为受控材料科学探针来研究原始缓冲液在随后的AlGaN/GaN异质结构再生过程中的结构状态的继承。将厚度约为1.5 μm的MOCVD-GaN缓冲层与厚度明显较薄的Al0.1Ga0.9N/AlN/SiC/Si(111)模板进行了比较。在两个模板上,形成了一个名义上相同的活性序列——AlN/GaN/AlN/AlGaN/GaN。采用霍尔测量、扫描电子显微镜(SEM)、透射电子显微镜(TEM)、原子力显微镜(AFM)、x射线衍射/互反空间映射(XRD/RSM)、x射线反射率(XRR)、拉曼光谱和光致发光等方法对结构进行了表征。结果显示了初始体系结构的明显继承。参考GaN/蓝宝石模板表现出更均匀的形貌,更窄的衍射分布,更高的xrd估计横向相干长度(~ 130相对于~ 41 nm)和更低的体积平均双轴应力(~ 0.55相对于~ 3-4 GPa)。SiC/Si模板的横截面TEM直接揭示了从MOCVD- algan层通过MOCVD/PA-MBE界面到PA-MBE-GaN层的扩展缺陷的对比,而GaN/蓝宝石上的结构在活性区表现出更均匀的微观结构。拉曼光谱进一步显示了一个结构不均匀的转换SiC中间层,具有多种SiC多型的贡献特征。在室温下,霍尔测量表明,这两种结构的有效薄片电子浓度约为3-4 × 1013 cm−2,SiC/Si和GaN/蓝宝石模板的有效迁移率分别约为510和690 cm2/(V·s)。由于霍尔数据本身不能排除氮化镓或再生界面处的平行传导,因此测量的薄片浓度不能解释为单个二维电子气体(2DEG)通道的确定浓度。同时,薄缓冲SiC/Si模板保留了厚缓冲GaN/蓝宝石基准的74%的有效霍尔迁移率。总体而言,数据表明初始SiC/Si结构的遗传不均匀性显著地导致了观察到的结构限制,并为进一步优化提供了具体的方向。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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