Optimizing thermoelectric efficiency: enhanced properties of gallium-doped indium oxide for advanced energy harvesting applications

IF 3.2 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Bo Feng, Zhiwen Yang, Suoluoyan Yang, Huimei Liu, Tongqiang Xiong, Zhipeng Zheng, Guopeng Zhou, Yin Zhong, Wenhua Dai
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引用次数: 0

Abstract

To optimize the thermoelectric performance of indium oxide, this study explores the regulatory effect of Ga doping on its structure and multiple properties. Ga doping can effectively regulate the electronic and microstructure of indium oxide, increasing carrier concentration, density of states near the Fermi level and electrical conductivity, while decreasing carrier mobility and the absolute value of Seebeck coefficient. The enhancement effect of electrical conductivity dominates, promoting the improvement of power factor. Meanwhile, Ga doping suppresses phonon transport, reduces total thermal conductivity and lattice thermal conductivity, and decreases heat loss. In terms of mechanical properties, Young’s modulus decreases to improve toughness, and Vickers hardness increases to enhance mechanical stability. In summary, Ga doping significantly improves the ZT value of the material by synergistically regulating electrical, thermal and mechanical properties, providing reference for the design and preparation of high-performance indium oxide-based thermoelectric materials.

优化热电效率:用于先进能量收集应用的掺镓氧化铟的增强性能
为了优化氧化铟的热电性能,本研究探索了Ga掺杂对氧化铟结构和多种性能的调控作用。Ga掺杂能有效调节氧化铟的电子和微观结构,增加载流子浓度、费米能级附近态密度和电导率,降低载流子迁移率和塞贝克系数绝对值。电导率的增强作用占主导地位,促进了功率因数的提高。同时,Ga掺杂抑制了声子输运,降低了总热导率和晶格热导率,减少了热损失。在力学性能方面,降低杨氏模量以提高韧性,提高维氏硬度以提高机械稳定性。综上所述,Ga掺杂通过协同调节材料的电学、热学和力学性能,显著提高了材料的ZT值,为高性能氧化铟基热电材料的设计和制备提供了参考。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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