Intisar Abbas Hamad, Anwar Ali Baqer, Mohammed Nadhim Abbas
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引用次数: 0
Abstract
In this work, porous spinel–spinel composite electrode materials based on aerogel frameworks derived from chitosan and architectures derived from ZIF-67 compounds were constructed using a systematic design approach. The chitosan aerogel template serves as both a precursor for self-generated conductive carbon and a three-dimensional porous scaffold, and was used to create porous Cu-based spinel oxides (CuMn2O4 and CuCo2O4). Then, the spinel surface was covered with a layer of ZIF-67 (a cobalt-based metal–organic framework), which was thermally transformed into porous spinel (Co3O4) to fabricate a hierarchical composite with synergistic effects and superior electrochemical properties. The structural, morphological, and compositional properties confirmed the successful formation of the prepared aerogel-derived materials. The electrochemical performance was evaluated using a three-electrode setup. The Co3O4/CuMn2O4 composite exhibited high specific capacitance of 3158 F g−1 at 1 A g−1 and stability of more than 80% after 4000 cycles. These results show that the simple, economical, and effective method for creating supercapacitor electrodes makes this type of aerogel-based structure a promising candidate for next-generation energy storage applications.
本文采用系统设计的方法,构建了基于壳聚糖气凝胶框架和ZIF-67化合物结构的多孔尖晶石-尖晶石复合电极材料。壳聚糖气凝胶模板作为自生成导电碳的前驱体和三维多孔支架,用于制备多孔cu基尖晶石氧化物(CuMn2O4和CuCo2O4)。然后,在尖晶石表面覆盖一层ZIF-67(一种钴基金属有机骨架),将其热转化为多孔尖晶石(Co3O4),制备出具有协同效应和优异电化学性能的分层复合材料。结构、形态和组成性质证实了制备的气凝胶衍生材料的成功形成。采用三电极装置对其电化学性能进行了评价。Co3O4/CuMn2O4复合材料在1 A g−1时具有3158 F g−1的高比电容,在4000次循环后稳定性超过80%。这些结果表明,制造超级电容器电极的简单、经济、有效的方法使这种基于气凝胶的结构成为下一代储能应用的有希望的候选者。
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.