Plasma-Assisted Milling of FeSiAl/Si3N4 Soft Magnetic Composites: Frequency-Tuned Interfacial Coupling For Synergistic Magnetic, Electrical, and Thermal Performance
IF 2.8 4区 工程技术Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
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引用次数: 0
Abstract
FeSiAl-based soft magnetic composites (SMCs) for medium- and high-frequency electromagnetic devices require high permeability, low core loss, and efficient thermal management. However, current insulation coating strategies are limited by poor coating continuity, weak interfacial adhesion, and insufficient thermal stability. In this work, FeSiAl/Si3N4 SMCs were fabricated via two-step plasma-assisted milling (PAM) combined with magnetic-field-assisted orientation forming, with the vibration frequency in the second PAM step used to regulate the microstructure, interfacial characteristics, and overall performance of the composite powders and compacts. The results show that Si3N4 was successfully introduced onto the powder surface while preserving the crystal structure of the FeSiAl matrix, thereby establishing chemically bonded interfaces involving Si–N, Si–O–N, and M–N (M = Fe, Al). First-principles calculations confirm that the FeSiAl(110)/Si3N4(120) heterointerface exhibits a binding energy of −5.08 J/m2, with its stability originating from charge transfer and the formation of Fe–N, Al–N, and Si–N bonds. As vibration frequency increased, the continuity of the Si3N4 coating layer and the interlayer insulating network first improved and then deteriorated. The 1300 rpm sample exhibited an effective permeability of 99.8 at 1 MHz, with a decline of less than 2% over 1 kHz–1 MHz, together with a saturation magnetization of 165.2 emu/g, an electrical resistivity of 192.1 Ω m, a total core loss of 72.8 kW m−3 at 50 mT/100 kHz, and a thermal conductivity of 28.3 W m−1 K−1. These results indicate that regulating the PAM frequency provides an effective route for coordinating the magnetic, electrical, and thermal properties of FeSiAl-based SMCs.
期刊介绍:
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.