Process Performance Evaluation of Modified Semiconductor Scrubber System via Process Simulation

Abstract

In semiconductor manufacturing, nitrous oxide (N₂O) is a major greenhouse gas emitted during processes such as SiO₂ deposition, requiring effective abatement technologies. Conventional semiconductor scrubber systems rely on catalytic thermal decomposition and wet scrubbing but suffer from high energy demand and excessive water consumption. To address these limitations, we designed a modified system integrating a waste heat recovery unit (WHRU) and compared its system performance with a conventional configuration using commercial process simulation. Validation against literature data and experimental measurements confirmed the accuracy of the model. Parametric analysis demonstrated that the modified system reduced power consumption by 55% and achieved a two-fold increase in system efficiency compared with the conventional system, with the optimal performance observed at a reaction temperature of 1,008 K. These results highlight the potential of WHRU-integrated scrubbers to enhance energy efficiency and sustainability in semiconductor exhaust gas treatment.