Polysilazane adhesive phase-mediated TiO2 photocatalytic interlayer for low-roughness copper-ceramic integration with optimized bond strength and reduced signal loss

IF 16.8 1区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Journal of Materials Science & Technology Pub Date : 2026-10-01 DOI:10.1016/j.jmst.2026.09.070

Fei Sun,Xuan Li,Kaining Zhang,Guozheng Yang,Zaitian Wang,Huawan Chen,Fei Long,Tong Zhou,Lie Liu

引用次数: 0

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聚硅氮烷粘合剂相介导TiO2光催化中间层的低粗糙度铜-陶瓷集成与优化的结合强度和减少信号损失

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Materials Science & Technology 工程技术-材料科学：综合

CiteScore

20.00

自引率

11.00%

发文量

995

审稿时长

13 days

期刊介绍： Journal of Materials Science & Technology strives to promote global collaboration in the field of materials science and technology. It primarily publishes original research papers, invited review articles, letters, research notes, and summaries of scientific achievements. The journal covers a wide range of materials science and technology topics, including metallic materials, inorganic nonmetallic materials, and composite materials.