{"title":"Relationship between current density and microstructure of Ti60 alloy during multi-physical field coupling process","authors":"Ren-hai YU, Ke-min XUE, Si-liang YAN, Ping LI","doi":"10.1016/S1003-6326(26)67119-1","DOIUrl":null,"url":null,"abstract":"<div><div>The effects of pulse current on recrystallization, dislocation density, deformation coordination, and texture evolution in Ti60 alloy were investigated through an electro-assisted tensile test under five different current densities. The results demonstrate that increasing current density significantly promotes atomic diffusion and dislocation annihilation, facilitating grain boundary migration and recrystallization. Enhanced pulse currents improve deformation coordination and overall formability of the Ti60 alloy. At a current density of 30 A/mm<sup>2</sup>, two dominant textures are observed, and the presence of multiple preferred planes at this level indicates superior plasticity compared to other conditions. Moreover, the Joule heating effect below 30 A/mm<sup>2</sup> primarily activates the basal <<em>a</em>> slip system as the main slip mechanism, while the athermal effect above 30 A/mm<sup>2</sup> favors the prismatic <<em>a</em>> slip system as the dominant slip mechanism. Among the tested conditions, 30 A/mm<sup>2</sup> achieves the most favorable balance between microstructural and mechanical performance, making it the optimal current density in this study.</div></div>","PeriodicalId":23191,"journal":{"name":"Transactions of Nonferrous Metals Society of China","volume":"36 9","pages":"Pages 2686-2700"},"PeriodicalIF":5.5000,"publicationDate":"2026-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of Nonferrous Metals Society of China","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1003632626671191","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/10/8 0:00:00","PubModel":"Epub","JCR":"Q1","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
引用次数: 0
Abstract
The effects of pulse current on recrystallization, dislocation density, deformation coordination, and texture evolution in Ti60 alloy were investigated through an electro-assisted tensile test under five different current densities. The results demonstrate that increasing current density significantly promotes atomic diffusion and dislocation annihilation, facilitating grain boundary migration and recrystallization. Enhanced pulse currents improve deformation coordination and overall formability of the Ti60 alloy. At a current density of 30 A/mm2, two dominant textures are observed, and the presence of multiple preferred planes at this level indicates superior plasticity compared to other conditions. Moreover, the Joule heating effect below 30 A/mm2 primarily activates the basal <a> slip system as the main slip mechanism, while the athermal effect above 30 A/mm2 favors the prismatic <a> slip system as the dominant slip mechanism. Among the tested conditions, 30 A/mm2 achieves the most favorable balance between microstructural and mechanical performance, making it the optimal current density in this study.
期刊介绍:
The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.