Contact Performance of Strap Contacts in HVdc Converter Transformer Valve-Side Bushings: A Review

IF 3.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Dielectrics and Electrical Insulation Pub Date : 2026-10-01 Epub Date: 2025-12-26 DOI:10.1109/TDEI.2025.3648257

Zhenglin Zeng;Guangning Wu;Kai Liu;Huichuan Tang;Binglei Cao

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Abstract

In high-voltage and ultrahigh-voltage power systems, the valve-side bushing of the converter transformer serves as a critical component connecting the transformer to the converter valve, with its operational reliability directly impacts the stability of the entire power system. The bushing endures prolonged exposure to high voltage, large current, and high-order harmonics during operation, leading to frequent failures. Particularly, defects in strap contacts constitute a predominant cause of valve-side bushing failures. As an essential electrical connection structure within a bushing, the contact performance of strap contacts is intrinsically linked to bushing stability. This review synthesizes recent advancements in Multiphysics coupling simulations, electrical contact performance analysis, and corrosion failure mechanisms related to strap contacts. Ultimately, valuable future research directions for strap contacts are summarized, providing technical support for the insulation design of valve-side bushing in high-voltage direct current (HVdc) projects.

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高压直流换流变压器阀侧套管带触点的接触性能研究

在高压、超高压电力系统中，换流变压器阀侧套管作为连接变压器与换流阀的关键部件，其运行可靠性直接影响到整个电力系统的稳定性。在工作过程中，套管承受长时间的高压、大电流和高次谐波，导致频繁的故障。特别是，皮带接触缺陷构成阀侧衬套失效的主要原因。作为衬套内部重要的电气连接结构，带式触头的接触性能与衬套的稳定性有着内在的联系。本文综述了在多物理场耦合模拟、电接触性能分析和与带接触有关的腐蚀失效机制方面的最新进展。最后总结了带触点今后有价值的研究方向，为高压直流工程阀侧套管的绝缘设计提供技术支持。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程：电子与电气

CiteScore

6.00

自引率

22.60%

发文量

309

审稿时长

5.2 months

期刊介绍： Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.