Emad M. Masoud, Walaa Alharbi, Khadijah H. Alharbi, Abdullah Fahad Alzayed, A. A. Menazea
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引用次数: 0
Abstract
Chitosan (CS)-based composite films containing Al2O3, Co3O4, and V2O5 were prepared to investigate the combined influence of metal oxide incorporation on the structural, thermal, optical, and dielectric properties of CS. Unlike studies that mainly examine the effect of individual oxide fillers, the present work comparatively evaluates the sequential CS, CS/Al2O3, CS/Al2O3/V2O5, and CS/Al2O3/V2O5/Co3O4 systems. Structural and compositional analyses confirmed the incorporation of the metal oxides into the CS matrix, while FESEM observations indicated a broadly distributed filler phase. Thermogravimetric analysis showed that all films remained thermally stable below approximately 300 °C, while the residual fraction increased from 1.7% for pure CS to 36.6% for CS/Al2O3/V2O5/Co3O4. The indirect optical band gap increased from 3.90 eV for pure CS to 5.35 eV after Al2O3 incorporation, then decreased to 3.40 and 3.00 eV after the subsequent addition of V2O5 and Co3O4, respectively. The corresponding refractive indices were 1.87, 1.58, 2.02, and 2.17. Dielectric measurements revealed a pronounced enhancement in the low-frequency permittivity, from approximately 200 for pure CS to approximately 1600 and 1200 for CS/Al2O3/V2O5 and CS/Al2O3/V2O5/Co3O4, respectively, followed by a decrease with increasing frequency. Impedance analysis further indicated enhanced charge-carrier transport and reduced interfacial resistance after V2O5 and Co3O4 incorporation. These findings demonstrate that sequential metal oxide incorporation provides an effective route for tuning the optical and dielectric/electrical response of chitosan-based composite films.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.