Optical and dielectric properties of Al2O3/V2O5/Co3O4-chitosan composite films for potential dielectric applications

IF 3.2 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Emad M. Masoud, Walaa Alharbi, Khadijah H. Alharbi, Abdullah Fahad Alzayed, A. A. Menazea
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引用次数: 0

Abstract

Chitosan (CS)-based composite films containing Al2O3, Co3O4, and V2O5 were prepared to investigate the combined influence of metal oxide incorporation on the structural, thermal, optical, and dielectric properties of CS. Unlike studies that mainly examine the effect of individual oxide fillers, the present work comparatively evaluates the sequential CS, CS/Al2O3, CS/Al2O3/V2O5, and CS/Al2O3/V2O5/Co3O4 systems. Structural and compositional analyses confirmed the incorporation of the metal oxides into the CS matrix, while FESEM observations indicated a broadly distributed filler phase. Thermogravimetric analysis showed that all films remained thermally stable below approximately 300 °C, while the residual fraction increased from 1.7% for pure CS to 36.6% for CS/Al2O3/V2O5/Co3O4. The indirect optical band gap increased from 3.90 eV for pure CS to 5.35 eV after Al2O3 incorporation, then decreased to 3.40 and 3.00 eV after the subsequent addition of V2O5 and Co3O4, respectively. The corresponding refractive indices were 1.87, 1.58, 2.02, and 2.17. Dielectric measurements revealed a pronounced enhancement in the low-frequency permittivity, from approximately 200 for pure CS to approximately 1600 and 1200 for CS/Al2O3/V2O5 and CS/Al2O3/V2O5/Co3O4, respectively, followed by a decrease with increasing frequency. Impedance analysis further indicated enhanced charge-carrier transport and reduced interfacial resistance after V2O5 and Co3O4 incorporation. These findings demonstrate that sequential metal oxide incorporation provides an effective route for tuning the optical and dielectric/electrical response of chitosan-based composite films.

Al2O3/V2O5/ co3o4 -壳聚糖复合薄膜的光学和介电性能
制备了含有Al2O3、Co3O4和V2O5的壳聚糖(CS)基复合薄膜,研究了金属氧化物掺入对CS结构、热、光学和介电性能的综合影响。与主要考察单个氧化物填料效果的研究不同,本研究比较评价了CS、CS/Al2O3、CS/Al2O3/V2O5和CS/Al2O3/V2O5/Co3O4体系。结构和成分分析证实了CS基体中存在金属氧化物,而FESEM观察表明存在广泛分布的填充相。热重分析表明,所有膜在300℃以下保持热稳定,残余分数从纯CS的1.7%增加到CS/Al2O3/V2O5/Co3O4的36.6%。加入Al2O3后,间接光学带隙由纯CS的3.90 eV增大到5.35 eV,加入V2O5和Co3O4后,间接光学带隙分别减小到3.40和3.00 eV。折射率分别为1.87、1.58、2.02、2.17。电介质测量显示,低频介电常数显著增强,从纯CS的约200增加到CS/Al2O3/V2O5和CS/Al2O3/V2O5/Co3O4的约1600和1200,然后随着频率的增加而降低。阻抗分析进一步表明,加入V2O5和Co3O4后,电荷载流子输运增强,界面电阻降低。这些发现表明,顺序的金属氧化物掺入为调整壳聚糖基复合薄膜的光学和介电/电响应提供了有效的途径。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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