Thickness-Field Excited Bimorph Lithium Niobate Piezoelectric Transducer

IF 3.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2026-10-01 Epub Date: 2026-07-23 DOI:10.1109/JMEMS.2026.3708315

Vakhtang Chulukhadze;Zihuan Liu;Lezli Matto;Ziqian Yao;Michael Liao;Tzu-Hsuan Hsu;Mark S. Goorsky;Neal Hall;Ruochen Lu

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引用次数: 0

Abstract

This work presents the first demonstration of a thickness-field-excited (TFE) lithium niobate (LN) flexural mode piezoelectric transducer. A

$\mathrm {300~\mu \text {m} }$

-thick periodically poled piezoelectric (P3F) 36Y LN bimorph is used to prototype. The transducer features a robust mechanical structure and optimized design, achieving a high electromechanical coupling coefficient (

$k^{2}$

) of 5% with a flexural-mode resonance of 115 kHz. Laser Doppler vibrometer (LDV) measurements indicate a good mode shape, whereas impedance measurements indicate excellent dielectric loss. The resulting TFE transducer exhibits high performance, linearity, and integrability, indicating promise as a low-loss, robust piezoelectric transducer platform. These results motivate a closer examination of the TFE LN piezoelectric micromachined ultrasonic transducer (PMUT) with a high capacitance density.[2026-0063]

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厚度场激发双晶片铌酸锂压电换能器

这项工作首次展示了一种厚度场激发（TFE）铌酸锂（LN）弯曲型压电换能器。采用$\ mathm {300~\mu \text {m}}$ $厚的周期极化压电（P3F） 36yln双晶片进行原型设计。该换能器具有坚固的机械结构和优化设计，实现了5%的高机电耦合系数（$k^{2}$），弯曲模共振为115 kHz。激光多普勒测振仪（LDV）测量结果表明具有良好的模态形状，而阻抗测量结果表明介质损耗优异。由此产生的TFE换能器具有高性能，线性性和可积性，表明有望成为低损耗，鲁棒的压电换能器平台。这些结果激发了对具有高电容密度的TFE LN压电微机械超声换能器（PMUT）的更深入研究。[2026-0063]

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.