High-Speed Micromilling of Copper Microbeams: Dimensional Control and Fabrication Limits for MEMS Applications

IF 3.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Debottam Bhowmik;Ashish Kumar Verma;Nitesh Kumar;Rinku Kumar Mittal
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引用次数: 0

Abstract

Copper microbeams are critical structural elements in microelectromechanical systems (MEMS), micro-sensors, and flexible electronic assemblies. However, their fabrication at microscales remains challenging due to copper’s high ductility and the dominance of size-effect phenomena. This study investigates the feasibility of high-speed micromilling for producing copper microbeams with widths ranging from $30~\upmu $ m down to $10~\upmu $ m. Experiments were conducted by varying feed per tooth and spindle speed to evaluate dimensional accuracy and burr formation mechanisms. Results show that $20~\upmu $ m microbeams fabricated at 20,000 rpm achieved dimensional deviations within 0.65–2.8%, demonstrating stable shearing-dominated cutting. In contrast, fabrication of $10~\upmu $ m beams was strongly influenced by the transition from shearing to ploughing, leading to pronounced burr formation and dimensional instability. Burr height decreased with an increase in feed rate from 1 to $2~\upmu $ m/tooth, but increased at $3~\upmu $ m/tooth, showing a narrow process window for burr-minimized fabrication. These findings establish the fabrication limits and process window for precision micromilling of copper microstructures and provide mechanistic insight into microscale material removal behavior relevant to MEMS device manufacturing. [2026-0034]
铜微梁的高速微铣削:MEMS应用的尺寸控制和制造限制
铜微梁是微机电系统(MEMS)、微传感器和柔性电子组件中的关键结构元件。然而,由于铜的高延展性和尺寸效应现象的主导地位,它们在微观尺度上的制造仍然具有挑战性。本研究探讨了高速微铣削加工宽度从$30~ $ upmu $ m到$10~ $ upmu $ m的铜微梁的可行性。通过改变每齿进给量和主轴转速进行了实验,以评估尺寸精度和毛刺形成机制。结果表明,在20000 rpm下加工的$20~\upmu $ m微梁的尺寸偏差在0.65 ~ 2.8%之间,表现出稳定的剪切主导切割。相比之下,$10~ $ upmu $ m梁的制造受到从剪切到犁削过渡的强烈影响,导致明显的毛刺形成和尺寸不稳定。毛刺高度随进给量从1 ~ 2~ $ upmu $ m/齿的增加而降低,但在$3~ $ upmu $ m/齿的进给量增加,显示出最小化毛刺制造的窄工艺窗口。这些发现确定了铜微结构精密微铣削的制造限制和工艺窗口,并提供了与MEMS器件制造相关的微尺度材料去除行为的机理见解。(2026 - 0034)
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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