Tilted Micro-Force Sensing Using a Dual-Port Surface Acoustic Wave Resonator Sensor

IF 3.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ke Zhai;Wenya Xu;Ning Zhang
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引用次数: 0

Abstract

Tilted micro-force sensing is of significant value for wafer contact testing, microindentation characterization, and precision machining. To investigate the response of surface acoustic wave (SAW) sensors under inclined loading conditions, this paper presents a miniaturized SAW micro-force sensor based on a dual-port resonator architecture. The sensor employs ST-X cut quartz as the piezoelectric substrate, and the dual-port resonator is formed by interdigital transducers and reflectors to convert strain variations induced by inclined loading into a frequency-shift response. A relationship between the applied inclined micro-force and the resonant frequency shift is established through finite-element simulations and subsequently validated experimentally. Experimental results show that, near an operating frequency of approximately 79 MHz, the sensor exhibits good linearity with respect to the applied force at inclination angles of 30°, 45°, and 60°. The experimentally characterized sensitivities are 91.14 kHz/N, 127.69 kHz/N, and 151.63 kHz/N, respectively. These results indicate that the proposed dual-port SAW sensor can provide a stable force-frequency response under inclined loading conditions, offering a feasible sensing approach for inclined micro-force detection. [2025-0251]
使用双端口表面声波谐振器传感器的倾斜微力传感
倾斜微力传感在晶圆接触测试、微压痕表征和精密加工中具有重要的应用价值。为了研究表面声波(SAW)传感器在倾斜载荷条件下的响应,提出了一种基于双端口谐振腔结构的小型化表面声波微力传感器。该传感器采用ST-X切割石英作为压电衬底,双端口谐振腔由数字间换能器和反射器组成,将倾斜加载引起的应变变化转换为频移响应。通过有限元模拟和实验验证了所施加的倾斜微力与谐振频移之间的关系。实验结果表明,在工作频率约为79 MHz时,传感器在倾角为30°、45°和60°时,与施加的力呈良好的线性关系。实验测得的灵敏度分别为91.14 kHz/N、127.69 kHz/N和151.63 kHz/N。结果表明,所设计的双端口声表面波传感器在倾斜载荷条件下能够提供稳定的力频响应,为倾斜微力检测提供了一种可行的传感方法。(2025 - 0251)
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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