Gas Leak Detection via Thin-Film Lithium Niobate pMUTs Integrating Optimized Acoustic Channels

IF 3.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2026-10-01 Epub Date: 2026-07-08 DOI:10.1109/JMEMS.2026.3709277

Jiayi Liu;Yejia Wu;Bingjin Jue;Qing Wan;Xianhao Le

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引用次数: 0

Abstract

This work presents a compact ultrasonic gas leak detection system utilizing a thin-film lithium niobate (LiNbO₃) piezoelectric micromachined ultrasonic transducer (pMUT) array, designed to exhibit enhanced sensitivity to gas leak-generated acoustic emissions within a specific frequency band. To realize high acoustic performance alongside fabrication feasibility, strategic device optimizations are implemented. A coplanar electrode configuration is adopted to ensure efficient electromechanical transduction, while simultaneously, the receiving sensitivity within the target band is further enhanced through an optimized acoustic channel integrated beneath the cavity-backed structure. Experimental validation demonstrates that miniaturizing the array to

$2\times 2$

elements causes negligible performance degradation, confirming the system’s compactness. Finally, coupled with an external signal-processing module for signal-to-noise ratio improvement, the proposed LiNbO₃ pMUT device offers a promising solution for passive, low-power, and noncontact gas leak monitoring in acoustically noisy environments. [2026-0074]

查看原文本刊更多论文

集成优化声学通道的铌酸锂薄膜pMUTs气体泄漏检测

本研究提出了一种紧凑的超声波气体泄漏检测系统，该系统利用薄膜铌酸锂（LiNbO3）压电微机械超声换能器（pMUT）阵列，旨在增强对特定频段内气体泄漏产生的声发射的灵敏度。为了实现高声学性能和制造可行性，实施了战略性的器件优化。采用共面电极结构，保证了高效的机电转导，同时，通过集成在腔背结构下方的优化声通道，进一步提高了目标频段内的接收灵敏度。实验验证表明，将阵列缩小到$2\ × 2$个元素导致的性能下降可以忽略不计，证实了系统的紧凑性。最后，结合提高信噪比的外部信号处理模块，所提出的LiNbO3 pMUT器件为声学噪声环境中的无源、低功耗和非接触式气体泄漏监测提供了一个有前途的解决方案。(2026 - 0074)

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.