Orientation-dependent interface-state properties underlying the “V”-shaped difference in temperature-dependent reverse characteristics of [010]- and [100]-oriented trench-MOSSBDs
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引用次数: 0
Abstract
In β-Ga2O3 MOS-type trench diodes, electro-thermal performance is strongly limited by poor trench-sidewall interface quality induced by anisotropic dry etching. This issue is more pronounced in [100]-oriented trenches, which exhibit higher sidewall thermal conductivity than [010]-oriented trenches. However, the orientation-dependent impact of interface states on device reliability and the underlying physical mechanisms remain unclear. This work elucidates, for the first time, the orientation-dependent interface-state properties responsible for the distinctive “V”-shaped temperature dependence of the reverse I–V characteristics between [010]- and [100]-oriented β-Ga2O3 trench MOS-type Schottky barrier diodes (trench-MOSSBDs) with HfO2 dielectric. Within the low-temperature range (25–125 °C), the “V”-shaped behavior in [100]-oriented trench-MOSSBD originates from the temperature-dependent competition between slow and fast interface-state charge trapping/de-trapping processes, whereas the reverse characteristics of [010]-oriented trench-MOSSBDs are predominantly governed by fast interface states. These findings provide important physical insights into interface-state engineering in anisotropic β-Ga2O3 trench structures and offer guidance for the electro-thermal co-design of high-performance β-Ga2O3 trench power devices.
期刊介绍:
Applied Physics Letters (APL) features concise, up-to-date reports on significant new findings in applied physics. Emphasizing rapid dissemination of key data and new physical insights, APL offers prompt publication of new experimental and theoretical papers reporting applications of physics phenomena to all branches of science, engineering, and modern technology.
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