Material design strategies for flexible n-type polymer semiconductors

FlexMat Pub Date : 2026-09-23 Epub Date: 2026-03-15 DOI:10.1002/flm2.70055
Xiao-Yan Zhang, Yang-Yang Zhou, Jie-Yu Wang, Jian Pei, Ze-Fan Yao
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Abstract

Flexible n-type polymer semiconductors enable materials for soft, wearable, and biointerfacing electronics, yet their development still lags behind p-type counterparts in both structural diversity and device performance. A unifying design goal is to preserve locally ordered aggregates and continuous percolated charge-transport pathways. In this perspective, we discuss recent advances from the view of multilevel design of conjugated polymers, covering molecular-level backbone and side-chain engineering, microstructure control through molecular-weight optimization, chain orientation modulation, and blending or networking with a soft matrix. Finally, we outline key remaining challenges and future opportunities for flexible n-type polymer semiconductors, including expanding the polymer scope, transitioning from empirical optimization toward predictive design models, building in situ characterization under mechanical deformation, and establishing standardized and application-relevant benchmarking protocols and open access databases, and improving long-term stability as well as manufacturing scalability.

柔性n型聚合物半导体材料设计策略
柔性n型聚合物半导体为软性、可穿戴性和生物界面电子产品提供了材料,但它们的发展在结构多样性和设备性能方面仍落后于p型半导体。一个统一的设计目标是保持局部有序的聚集体和连续的渗透电荷传输途径。在这方面,我们从共轭聚合物的多层次设计的角度讨论了最近的进展,包括分子水平的主链和侧链工程,通过分子量优化的微观结构控制,链取向调制,以及与软基质的共混或网络。最后,我们概述了柔性n型聚合物半导体的主要挑战和未来机遇,包括扩大聚合物范围,从经验优化向预测设计模型过渡,建立机械变形下的原位表征,建立标准化和应用相关的基准协议和开放访问数据库,以及提高长期稳定性和制造可扩展性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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