Memristor-Based Sensing–Memory–Computing Integrated Sensors: Mechanisms, Materials, Architectures, and Applications

IF 3.3 Q2 CHEMISTRY, ANALYTICAL
Zilu Zhao, Xiaolan Luo, Jun Wang, Xiangsheng Chen, Hong Yuan, Yuanjie Su
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Abstract

Conventional sensing systems based on physically separated sensing, memory, and computing units suffer from substantial data-transfer overhead, latency, and energy consumption, limiting their deployment in edge intelligence and the Internet of Things. Memristive in-sensor computing has emerged as a promising hardware paradigm by integrating stimulus perception, state retention, and information processing within a single device or array. This review discusses memristor-based sensing-memory-computing integrated sensors from four perspectives: response modality, material system, fabrication and integration strategy, and device architecture. Working mechanisms and sensing behaviors are classified into digital memristors for event-driven functions and binary or low-bit synapses, and analog memristors for gradual weight modulation, feature extraction, and high-precision neuromorphic computing. Representative material platforms, including oxides, two-dimensional materials, organic materials, halide perovskites, electrochemical metallization systems, ferroelectric systems, and phase-change and correlated materials, are compared in terms of operating mechanisms, stimulus-coupling pathways, advantages, and limitations. The effects of thin-film deposition, post-treatment, patterning, and array integration on device uniformity, manufacturability, and scalability are further discussed. Finally, recent progress in visual, tactile, and biomimetic perception is reviewed, and key challenges and future directions are outlined for next-generation systems for edge intelligence.

基于忆阻器的传感-存储-计算集成传感器:机制、材料、架构和应用
基于物理分离的传感、内存和计算单元的传统传感系统存在大量的数据传输开销、延迟和能耗,限制了它们在边缘智能和物联网中的部署。Memristive传感器内计算通过在单个设备或阵列中集成刺激感知、状态保留和信息处理,已经成为一种有前途的硬件范例。本文从响应方式、材料体系、制造和集成策略以及器件结构四个方面对基于忆阻器的传感-存储-计算集成传感器进行了综述。工作机制和传感行为分为用于事件驱动函数和二进制或低位突触的数字忆阻器和用于逐渐权重调制、特征提取和高精度神经形态计算的模拟忆阻器。比较了具有代表性的材料平台,包括氧化物、二维材料、有机材料、卤化物钙钛矿、电化学金属化系统、铁电系统以及相变和相关材料的运行机制、刺激耦合途径、优势和局限性。进一步讨论了薄膜沉积、后处理、图像化和阵列集成对器件均匀性、可制造性和可扩展性的影响。最后,回顾了视觉,触觉和仿生感知的最新进展,并概述了下一代边缘智能系统的关键挑战和未来方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
2.60
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0.00%
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