A Wideband Single-Beam Four-Element QFN Transmit/Receive Beamformer IC in 65-nm CMOS

IF 5.2 1区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Kim Phan Van;Sanghun Lee;Cuong Huynh
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引用次数: 0

Abstract

This article presents a wideband single-beam four-element transmit (TX)/receive (RX) beamformer integrated circuit (BFIC) fabricated in 65-nm complementary metal oxide semiconductor (CMOS) and implemented in a quad flat no-lead (QFN) package, targeting phased-array front ends operating across 8–16 GHz. Each channel integrates a full 360° phase shifter (PS) with 2.8125° resolution and a 35-dB gain control range with 0.18-dB resolution, enabling beam steering and amplitude tapering over an octave bandwidth. Measured over 8–16 GHz, the proposed IC achieves 1.78° root mean square (rms) phase error and 0.23-dB rms gain error. In the TX path, the IC provides 23.5-dB gain and delivers 8.3-dBm output 1-dB compression point (OP1dB), 12.6-dBm saturated output power (PSAT), and 19.4-dBm output third-order intercept point (OIP3), while consuming 198.5 mW per channel. In the RX path, it achieves 9.7-dB gain with 5.9-dB noise figure (NF), together with −18.1-dBm input 1-dB compression point (IP1 dB) and −7.4-dBm input third-OIP3 (IIP3), while consuming 89 mW per channel. For 50-Ms/s quadrature phase-shift keying (QPSK), 8-PSK, 16-QAM, and 64-QAM signals at 8, 12, and 16 GHz with input power from −50 to −5 dBm, the BiCMOS ultrawideband flip-chip packaging RX beamformer IC (BFIC) exhibits minimum error vector magnitude (EVM) below 2.7% in both TX and RX paths. The chip occupies 17.6 mm2 ( $4.4\times 4$ mm2). To the best of our knowledge, the key innovations of this work include the first demonstrations of a fully integrated wideband 8–16-GHz 4 T/4 R QFN BFIC in 65-nm CMOS, a comparative analysis of QFN bondwire configurations with and without downbonding for wideband multichannel operation, and a phase/gain tuning optimization algorithm that minimizes the rms phase and gain errors.
一种基于65nm CMOS的宽带单波束四元QFN发射/接收波束形成电路
本文提出了一种宽带单波束四元发射/接收波束形成集成电路(BFIC),采用65纳米互补金属氧化物半导体(CMOS)制造,采用四平面无引线(QFN)封装,目标是工作在8-16 GHz范围内的相控阵前端。每个通道集成了一个完整的360°移相器(PS),分辨率为2.8125°,35 db增益控制范围为0.18 db,可在一个倍频带宽内实现波束转向和幅度递减。在8-16 GHz范围内测量,该集成电路实现了1.78°均方根相位误差和0.23 db增益误差。在TX路径中,IC提供23.5 db增益,提供8.3 dbm输出1 db压缩点(OP1dB), 12.6 dbm饱和输出功率(PSAT)和19.4 dbm输出三阶截距点(OIP3),而每通道消耗198.5 mW。在RX路径中,它实现了9.7 dB增益和5.9 dB噪声系数(NF),以及−18.1 dbm输入1 dB压缩点(IP1 dB)和−7.4 dbm输入3 - oip3 (IIP3),而每通道消耗89 mW。对于50ms /s正交相移键控(QPSK), 8- psk, 16- qam和64-QAM信号在8,12和16 GHz,输入功率为- 50至- 5 dBm, BiCMOS超宽带倒装RX波束形成IC (BFIC)在TX和RX路径上的最小误差矢量幅度(EVM)均低于2.7%。该芯片占地17.6 mm2(4.4美元× 4 mm2美元)。据我们所知,这项工作的关键创新包括在65纳米CMOS中首次演示了完全集成的宽带8 - 16 ghz 4 T/4 R QFN BFIC,对宽带多通道操作的QFN键合线配置进行了比较分析,并对其进行了相位/增益调谐优化算法,该算法可以最大限度地减少相位和增益误差。
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来源期刊
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Microwave Theory and Techniques 工程技术-工程:电子与电气
CiteScore
8.60
自引率
18.60%
发文量
486
审稿时长
6 months
期刊介绍: The IEEE Transactions on Microwave Theory and Techniques focuses on that part of engineering and theory associated with microwave/millimeter-wave components, devices, circuits, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, and industrial, activities. Microwave theory and techniques relates to electromagnetic waves usually in the frequency region between a few MHz and a THz; other spectral regions and wave types are included within the scope of the Society whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.
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