Autonomous driving chips

IF 34.8
Qiujing Lu, Sihong Wu, Yifan Liu, Ziwei Huang, Yue Zhou, Boyi Dong, Tianyi Zhang, Linsen Li, Kaichen Zhu, Haowen Shu, Haikang Diao, Kaiteng Tan, Yu Liu, Xudong Zheng, Hongkai Ning, Yi Wan, Xuanhan Wang, Runze Yuan, Hongyan Sang, Xiaodong Yan, Ling Wang, Tong Dang, Aijia Yao, Zhien Wang, Aaron D. Franklin, Zhengshuai Wang, Jeffrey H. Lang, Jinchi Han, Xiyuan Tang, Kenan Zhang, Tilo H. Yang, Peng Wu, Jiangtao Wang, Qinghua Huang, Jiajia Sun, Jiefu Chen, Xuqing Wu, Yuanjin Zheng, Lin Xu, Yunyue Zhu, Jian Wang, Ruixuan Chen, Meng-Chi Chen, Xingjun Wang, Xiang Cheng, Biao Qin, Kaihui Liu, Hailin Peng, Mario Lanza, Saptarshi Das, Lain-Jong Li, Xiangfeng Duan, Vwani Roychowdhury, Vladimir Bulović, Tomás Palacios, Jing Kong, Shuo Feng, Lian-Mao Peng, Jianfeng Jiang
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Abstract

The automobile is undergoing a dramatic transformation — from a conventional mode of transportation to an intelligent, interconnected terminal within the Internet of Everything. As driving functions progressively shift from human drivers to onboard AI systems, vehicles are becoming intelligent agents operating in complex, safety-critical environments. In this transition, autonomous driving chips are emerging as a key determinant of whether safe, scalable and commercially viable autonomy can be achieved. We argue that the future of autonomous driving will be shaped by a widening gap between rapidly growing computational demands and the physical limits of conventional chip technologies. Closing this gap requires a paradigm shift from isolated hardware or software innovation towards holistic hardware–software codesign. This Perspective examines how increasingly stringent requirements for safety, real-time intelligence and cost are reshaping the design of autonomous driving chips, and discusses the challenges of sustaining performance growth as conventional scaling approaches slow down. Particular attention is given to emerging opportunities in advanced materials, logic and memory technologies, heterogeneous monolithic three-dimensional integration and domain-specific architectures. By connecting developments across semiconductor technology and autonomous driving algorithms, we discuss the key technological bottlenecks, design trade-offs and cross-disciplinary innovations that are likely to shape the next generation of intelligent computing platforms for autonomous systems. This Perspective examines how increasingly stringent requirements for safety, real-time intelligence and cost are reshaping the design of autonomous driving chips, and discusses the challenges of sustaining performance growth as conventional scaling approaches slow down.
自动驾驶芯片
汽车正在经历一场戏剧性的变革——从传统的交通工具转变为万物互联中的智能互联终端。随着驾驶功能逐渐从人类驾驶员转向车载人工智能系统,车辆正在成为在复杂、安全关键环境中运行的智能代理。在这一转变中,自动驾驶芯片正在成为能否实现安全、可扩展和商业上可行的自动驾驶的关键决定因素。我们认为,快速增长的计算需求与传统芯片技术的物理极限之间日益扩大的差距,将塑造自动驾驶的未来。要缩小这一差距,需要从孤立的硬件或软件创新转向整体的软硬件协同设计。本文探讨了日益严格的安全、实时智能和成本要求如何重塑自动驾驶芯片的设计,并讨论了在传统扩展方法放缓的情况下保持性能增长所面临的挑战。特别关注先进材料,逻辑和存储技术,异质单片三维集成和特定领域架构方面的新兴机会。通过将半导体技术和自动驾驶算法的发展联系起来,我们讨论了关键的技术瓶颈、设计权衡和跨学科创新,这些创新可能会塑造下一代自动驾驶系统的智能计算平台。本文探讨了日益严格的安全、实时智能和成本要求如何重塑自动驾驶芯片的设计,并讨论了在传统扩展方法放缓的情况下保持性能增长所面临的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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