Jyh-Chen Chen, Huy-Thinh Vo, Tuan Ngoc Anh Vo, Minh-Tuan Ho
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引用次数: 0
Abstract
GaN-based light-emitting diodes (LEDs) experience efficiency droop, limiting high-power performance. This study investigates vertical thin-film chips (TFC) and lateral nervure-like chips (NLC) from chip to package levels via experiments and numerical simulations. To overcome the parameter distortion inherent to conventional single-pass simulations, this work introduces a closed-loop, absorption-aware iterative framework. By dynamically feeding volumetric optical losses back into the electrical rate equations, the proposed model extracts pure recombination parameters that are physically decoupled from macroscopic packaging degradation. Results indicate that current crowding intensifies with input power and junction temperature, causing non-uniform carrier distribution and enhanced non-radiative recombination. Fitted coefficients reveal higher high-injection losses in NLC (larger C and α0) than TFC, correlating with earlier, more severe droop. Optical analysis shows that light extraction efficiency (LEE) decreases as input power rises; at 2.1 W, the LEE drop is 24.47% for NLC and 17.94% for TFC compared to 0.1 W operation. Critically, temperature-dependent absorption in the active region is essential to replicate experimental trends. These findings offer practical strategies for high-power LED packaging and current spreading designs to mitigate efficiency droop.
期刊介绍:
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.