{"title":"In Situ Growth of Cu2S on Carbon Cloth Assisted by Tannic Acid for Supercapacitor Applications","authors":"Haijun Wang, Yongquan Wang, Yongli Liang, Yuan Shen","doi":"10.1007/s11664-026-13065-9","DOIUrl":null,"url":null,"abstract":"<div><p>Carbon cloth serves as a widely utilized flexible substrate for supercapacitor electrodes. This study presents a novel tannic acid-assisted strategy to <i>in situ</i> anchor cuprous sulfide (Cu<sub>2</sub>S) onto carbon cloth, where tannic acid functions through triple mechanisms: chelating copper ions for stable anchoring, preventing Cu<sub>2</sub>S detachment to maintain high loading capacity, and reducing charge transfer resistance. Comprehensive characterization confirms the uniform distribution and strong adhesion of Cu<sub>2</sub>S nanoparticles on the tannic acid-treated carbon cloth. The resulting tannic acid-impregnated carbon cloth (TCC)-Cu<sub>2</sub>S electrode achieves exceptional electrochemical performance with a high specific capacitance of 742.25 F g<sup>−1</sup> at 10 mV s<sup>−1</sup>, an ultralow internal resistance of 0.5 Ω, and outstanding cycling stability retaining 90.47% capacitance after 10,000 charge–discharge cycles. This work establishes a simple, ecofriendly approach for fabricating high-performance flexible supercapacitors with significantly enhanced stability and conductivity.</p><h3>Graphical Abstract</h3>\n<div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"55 10","pages":"8646 - 8655"},"PeriodicalIF":2.8000,"publicationDate":"2026-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11664-026-13065-9","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Carbon cloth serves as a widely utilized flexible substrate for supercapacitor electrodes. This study presents a novel tannic acid-assisted strategy to in situ anchor cuprous sulfide (Cu2S) onto carbon cloth, where tannic acid functions through triple mechanisms: chelating copper ions for stable anchoring, preventing Cu2S detachment to maintain high loading capacity, and reducing charge transfer resistance. Comprehensive characterization confirms the uniform distribution and strong adhesion of Cu2S nanoparticles on the tannic acid-treated carbon cloth. The resulting tannic acid-impregnated carbon cloth (TCC)-Cu2S electrode achieves exceptional electrochemical performance with a high specific capacitance of 742.25 F g−1 at 10 mV s−1, an ultralow internal resistance of 0.5 Ω, and outstanding cycling stability retaining 90.47% capacitance after 10,000 charge–discharge cycles. This work establishes a simple, ecofriendly approach for fabricating high-performance flexible supercapacitors with significantly enhanced stability and conductivity.
期刊介绍:
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.