An Overview of Chiplet and Integrated Chip Testing Technologies

Abstract

Chiplet and integrated chip technologies, one of the mainstream methods to enhance chip performance in the post-Moore era, have garnered significant attention from academia and industry. Testing technology plays a crucial role in ensuring the reliability and functionality of the product, and is a key area that requires breakthroughs in the development of chiplets and integrated chips. This paper offers a comprehensive overview of chiplet and integrated chip testing technologies, analyzing the current research status and challenges encountered in this critical field. In this paper, we first explore the testing process of integrated chips, including design for test (DfT), Known Good Die testing, integrated module testing, final testing, and system-level testing. The current research trends in integrated chip testing are reviewed, focusing on system-level DfT techniques and inter-chiplet interconnection testing methods. This article also introduces the testing equipment and fixtures required for integrated chip testing, as well as electronic design automation tools. Finally, the challenges and future directions faced by integrated chip testing technology are explored.