An Accurate 3.3 kV SiC MOSFET Empirical Model Considering Temperature Effects

IF 4.5 4区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Chinese Journal of Electronics Pub Date : 2026-07-01 Epub Date: 2026-09-09 DOI:10.23919/cje.2025.00.386
Jie Wang;Qingwen Song;Aijun Zhang;Yibo Zhang;Xiaoyan Tang;Hao Yuan;Yuming Zhang
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引用次数: 0

Abstract

Silicon carbide metal-oxide-semiconductor field-effect transistors (SiC MOSFETs) show significant advantages in diverse application scenarios due to their superior performance. However, the existing simulation program with integrated circuit emphasis models developed for low-voltage devices cannot be effectively applied to high-voltage (> 3.3 kV) SiC MOSFETs in practical applications, which may cause unreliable circuit simulations. This paper presents an empirical model for 3.3 kV SiC MOSFETs that considers temperature effects. The model focuses on static and dynamic characteristics using non-segmented equations, ensuring smooth and accurate predictions of the device's output and transfer characteristics. Besides, temperature-dependent parameters are incorporated into the equations to correctly reflect the correlation between characteristics and temperature.For the capacitance model, the new compensation equation is added to the commonly used capacitance fitting equations, and the accuracy of this enhanced capacitance model is verified by fitting the capacitance experimental results of the device using the new capacitance equations. The body diode modeling adopts a combined approach of parameter extraction using the model editor and equation fitting. The adoption of non-segmented effectively avoids convergence problems inherent in traditional segmented models, while the integration of compensation equations brings simulation results closer to real operating conditions. Moreover, the incorporation of temperature-dependent parameters expands the model's applicability, enabling it to better support related design processes.
考虑温度效应的3.3 kV SiC MOSFET精确经验模型
碳化硅金属氧化物半导体场效应晶体管(SiC mosfet)由于其优异的性能在各种应用场景中显示出显著的优势。然而,现有针对低压器件开发的集成电路重点模型仿真程序,在实际应用中无法有效应用于高压(> 3.3 kV) SiC mosfet,可能导致电路仿真不可靠。本文提出了考虑温度效应的3.3 kV SiC mosfet的经验模型。该模型使用非分段方程关注静态和动态特性,确保对设备输出和传输特性的平滑和准确预测。此外,在方程中加入了温度相关参数,以正确反映特征与温度的相关性。对于电容模型,将新的补偿方程加入到常用的电容拟合方程中,并利用新电容方程拟合器件的电容实验结果,验证了该增强电容模型的准确性。体二极管建模采用模型编辑器提取参数和方程拟合相结合的方法。采用非分段的方法有效地避免了传统分段模型固有的收敛性问题,而补偿方程的积分使仿真结果更接近实际工况。此外,温度相关参数的加入扩展了模型的适用性,使其能够更好地支持相关的设计过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Chinese Journal of Electronics
Chinese Journal of Electronics 工程技术-工程:电子与电气
CiteScore
3.70
自引率
16.70%
发文量
342
审稿时长
12.0 months
期刊介绍: CJE focuses on the emerging fields of electronics, publishing innovative and transformative research papers. Most of the papers published in CJE are from universities and research institutes, presenting their innovative research results. Both theoretical and practical contributions are encouraged, and original research papers reporting novel solutions to the hot topics in electronics are strongly recommended.
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